Inventor · disambiguated record
Song-Fu Yang
Also filed as: YANG SONG-FU
3 granted patents·2 pending applications·13 citations·filing 2006–2007
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0173US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 0268US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 0355US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 0441US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0540US2008035706A1Wire-bonding apparatus and wire-bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →