Inventor · disambiguated record
Chih-Kung Huang
Also filed as: HUANG CHIH-KUNG
22 granted patents·17 pending applications·332 citations·filing 1991–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8IBIS INNOTECH INC5BIAR JEFF4BIAR JIN-CHYUAN3SITRON PRECISION CO LTD3
Top patents by PatentIndex Score
39 records- 0190US11328971B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0284US8468888B2MEMS sensor capable of sensing acceleration and pressureWU MING-CHING·Filed 2010·Granted Jun 25, 2013·8 cites·14 claims
- 0382US10109547B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 23, 2018·3 cites·20 claims
- 0482US6392305B1Chip scale package of semiconductorFiled 2000·Granted May 21, 2002·35 cites·22 claims
- 0580US2025349787A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0678US6215176B1Dual leadframe packageSITRON PREC CO LTD·Filed 1999·Granted Apr 10, 2001·63 cites·17 claims
- 0775US5882955ALeadframe for integrated circuit package and method of manufacturing the sameSITRON PRECISION CO LTD·Filed 1997·Granted Mar 16, 1999·50 cites·13 claims
- 0872US2024250055A1Package structure with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0971US5994767ALeadframe for integrated circuit package and method of manufacturing the sameSITRON PRECISION CO LTD·Filed 1998·Granted Nov 30, 1999·41 cites·3 claims
- 1071US2025316560A1Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1167US5889317ALeadframe for integrated circuit packageSITRON PRECISION CO LTD·Filed 1997·Granted Mar 30, 1999·35 cites·20 claims
- 1265US11978715B2Structure and formation method of chip package with protective lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 1365US6177719B1Chip scale package of semiconductorFiled 2000·Granted Jan 23, 2001·13 cites·14 claims
- 1461US12374600B2Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1560US9451694B2Package substrate structureIBIS INNOTECH INC·Filed 2015·Granted Sep 20, 2016·1 cites·35 claims
- 1658US10727147B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 1758US6677055B1Tape structure and manufacturing methodKINGTRON ELECTRONICS CO LTD·Filed 2002·Granted Jan 13, 2004·10 cites·6 claims
- 1857US7737452B2Light-emitting element package and light source apparatus using the sameBIAR JIN-CHYUAN·Filed 2007·Granted Jun 15, 2010·4 cites·37 claims
- 1957US6344687B1Dual-chip packagingFiled 1999·Granted Feb 5, 2002·24 cites·21 claims
- 2057US6078099ALead frame structure for preventing the warping of semiconductor package bodyWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jun 20, 2000·24 cites·28 claims
- 2152US2015061814A1Ferrite circuit boardIBIS INNOTECH INC·Filed 2014·Application pending·0 cites
- 2252US2010301504A1Method of making light-guiding moduleIBIS INNOTECH INC·Filed 2009·Application pending·0 cites
- 2348US2016034083A1Touch sensing deviceIBIS INNOTECH INC·Filed 2014·Application pending·0 cites
- 2444US6262475B1Lead frame with heat slugWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jul 17, 2001·11 cites·18 claims
- 2543US2008265356A1Chip size image sensing chip packageBIAR JIN-CHYUAN·Filed 2008·Application pending·0 cites
- 2643US2008265388A1Ultra thin image sensing chip packageBIAR JIN-CHYUAN·Filed 2008·Application pending·0 cites
- 2736US7122124B2Method of fabricating film carrierKINGTRON ELECTRONICS CO LTD·Filed 2005·Granted Oct 17, 2006·0 cites·13 claims
- 2836US6521521B1Bonding pad structure and method for fabricating the sameFU SHENG IND CO LTD·Filed 2000·Granted Feb 18, 2003·0 cites·17 claims
- 2936US2005196902A1Method of fabricating film carrierFiled 2005·Application pending·0 cites
- 3035US2012056280A1MEMS Sensor PackageWU MING-CHING·Filed 2010·Application pending·0 cites
- 3134US7675159B2Base substrate for chip scale packagingBIAR JEFF·Filed 2007·Granted Mar 9, 2010·0 cites·6 claims
- 3234US2004036151A1Double leadframe-based packaging structure and manufacturing process thereofFiled 2003·Application pending·0 cites
- 3334US2004207066A1Lead on chip package and leadframe thereofFiled 2003·Application pending·0 cites
- 3433US2015364448A1Package structureIBIS INNOTECH INC·Filed 2015·Application pending·0 cites
- 3533US2008248270A1Substrate for thin chip packagingsBIAR JEFF·Filed 2008·Application pending·0 cites
- 3633US2001001069A1Metal stud array packagingFiled 2000·Application pending·0 cites
- 3730US2013213698A1Holder for semiconductor packageBIAR JEFF·Filed 2012·Application pending·0 cites
- 3828US5188986AHydrogen peroxide in basic solution to clean polycrystalline silicon after phosphorous diffusionUNITED MICROELECTRONICS CORP·Filed 1991·Granted Feb 23, 1993·8 cites·15 claims
- 3926US2012099285A1Laminated substrate with coilsBIAR JEFF·Filed 2011·Application pending·0 cites
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