Inventor · disambiguated record
Alexander Breymesser
Also filed as: BREYMESSER ALEXANDER
32 granted patents·12 pending applications·45 citations·filing 2012–2025
95Inventor score
Files withINFINEON TECHNOLOGIES AG32INFINEON TECHNOLOGIES AUSTRIA AG7BREYMESSER ALEXANDER2INFINEON TECHNOLOGIES AUSTRIA2VON KOBLINSKI CARSTEN1
Top patents by PatentIndex Score
44 records- 0192US11641779B2Thermoelectric devices and methods for forming thermoelectric devicesINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 2, 2023·2 cites·8 claims
- 0292US10903078B2Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·9 cites·28 claims
- 0387US11742215B2Methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 29, 2023·1 cites·16 claims
- 0485US9558948B1Laser thermal annealing of deep doped region using structured antireflective coatingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jan 31, 2017·4 cites·20 claims
- 0583US10615040B2Superjunction structure in a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·3 cites·11 claims
- 0682US9570542B2Semiconductor device including a vertical edge termination structure and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 14, 2017·4 cites·15 claims
- 0778US10112861B2Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·1 cites·21 claims
- 0878US9601376B2Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 21, 2017·2 cites·23 claims
- 0977US12211703B2Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 1077US9917333B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 13, 2018·2 cites·20 claims
- 1175US8841768B2Chip package and a method for manufacturing a chip packageVON KOBLINSKI CARSTEN·Filed 2012·Granted Sep 23, 2014·5 cites·26 claims
- 1274US9219020B2Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devicesBREYMESSER ALEXANDER·Filed 2012·Granted Dec 22, 2015·3 cites·24 claims
- 1371US9981844B2Method of manufacturing semiconductor device with glass piecesBREYMESSER ALEXANDER·Filed 2012·Granted May 29, 2018·3 cites·6 claims
- 1467US9704712B1Method of making a semiconductor device formed by thermal annealingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·1 cites·22 claims
- 1567US9390883B2Implantation apparatus with ion beam directing unit, semiconductor device and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jul 12, 2016·1 cites·7 claims
- 1667US2019023600A1Method of Manufacturing a Plurality of Glass Members, a Method of Manufacturing an Optical Member, and Array of Glass Members in a Glass SubstrateINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1766US9385075B2Glass carrier with embedded semiconductor device and metal layers on the top surfaceINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 5, 2016·2 cites·21 claims
- 1865US2022359428A1Method for Processing a Semiconductor Wafer and Semiconductor Composite StructureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1965US2022293558A1Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2063US9754787B2Method for treating a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 5, 2017·1 cites·19 claims
- 2163US2025096149A1Semiconductor device with a silicon carbide portion and a glass structure and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2263US2025194206A1Semiconductor device and method of fabricating a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2362US10998402B2Semiconductor devices with steep junctions and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 4, 2021·0 cites·20 claims
- 2462US9224806B2Edge termination structure with trench isolation regionsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 29, 2015·1 cites·19 claims
- 2562US2017197865A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Application pending·0 cites
- 2659US11515264B2Method for processing a semiconductor wafer, semiconductor composite structure and support structure for semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 29, 2022·0 cites·15 claims
- 2759US2015175467A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 2857US2024339506A1Semiconductor device and method of fabricating a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2957US2024128329A1Semiconductor device and method of producing a cavity in a trenchINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 3056US11557506B2Methods for processing a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 3155US10475881B2Semiconductor devices with steep junctions and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 12, 2019·0 cites·21 claims
- 3254US10049912B2Method of manufacturing a semiconductor device having a vertical edge termination structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 14, 2018·0 cites·15 claims
- 3354US9809877B2Ion implantation apparatus with ion beam directing unitINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 7, 2017·0 cites·5 claims
- 3453US12046509B2Semiconductor device protection using an anti-reflective layerINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 23, 2024·0 cites·24 claims
- 3553US11393784B2Semiconductor package devices and method for forming semiconductor package devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 19, 2022·0 cites·20 claims
- 3653US11148943B2Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass piecesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
- 3752US11139375B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 3852US2019131508A1Thermoelectric Devices and Methods for Forming Thermoelectric DevicesINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3951US11856711B2Rogowski coil integrated in glass substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 26, 2023·0 cites·30 claims
- 4051US2025324710A1Semiconductor Device and Method of Manufacturing the SameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 4147US10749216B2Battery, integrated circuit and method of manufacturing a batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 18, 2020·0 cites·20 claims
- 4243US10153339B2Semiconductor device and method for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 11, 2018·0 cites·18 claims
- 4342US9111989B2Insulated gate bipolar transistor including emitter short regionsINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
- 4435US2016372393A1Laminar Structure, a Semiconductor Device and Methods for Forming Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →