Inventor · disambiguated record
Kazuyoshi Tendou
Also filed as: TENDOU KAZUYOSHI
3 granted patents·2 pending applications·26 citations·filing 2004–2017
65Inventor score
Top patents by PatentIndex Score
5 records- 0182US7675185B2Epoxy resin molding material for sealing and electronic componentHITACHI CHEMICAL CO LTD·Filed 2004·Granted Mar 9, 2010·20 cites·13 claims
- 0272US7981977B2Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic fillerHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jul 19, 2011·6 cites·10 claims
- 0347US7982322B2Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the sameHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jul 19, 2011·0 cites·16 claims
- 0435US2019241694A1Curable composition for forming elastic resin layerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0534US2009247670A1Epoxy Resin Molding Material for Sealing, and Electronic Component DeviceHAMADA MITSUYOSHI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →