Inventor · disambiguated record
Shashi Gupta
Also filed as: GUPTA SHASHI · GUPTA SHASHI K · GUPTA SHASHI KANT
8 granted patents·4 pending applications·45 citations·filing 2009–2025
83Inventor score
Top patents by PatentIndex Score
12 records- 0186US7851930B1Conductive adhesive compositions containing an alloy filler material for better dispense and thermal propertiesHENKEL CORP·Filed 2009·Granted Dec 14, 2010·18 cites·12 claims
- 0270US12042883B2Sinterable films and pastes and methods for use thereofHENKEL AG & CO KGAA·Filed 2023·Granted Jul 23, 2024·0 cites·13 claims
- 0370US11745294B2Sinterable films and pastes and methods for use thereofHENKEL AG & CO KGAA·Filed 2017·Granted Sep 5, 2023·1 cites·7 claims
- 0470US2025329323A1Systems and methods for audio transcription switching based on real-time identification of languages in an audio streamRINGCENTRAL INC·Filed 2025·Application pending·0 cites
- 0564USD802159STray assembly for syringes and ampoulesUVAMED LTD·Filed 2015·Granted Nov 7, 2017·11 cites·1 claims
- 0659US12361924B2Systems and methods for audio transcription switching based on real-time identification of languages in an audio streamRINGCENTRAL INC·Filed 2022·Granted Jul 15, 2025·0 cites·19 claims
- 0758USD846144STray for syringes and ampoulesUVAMED LTD·Filed 2015·Granted Apr 16, 2019·10 cites·1 claims
- 0847USD840052SOuter tray for syringes and ampoulesUVAMED INC·Filed 2017·Granted Feb 5, 2019·5 cites·1 claims
- 0946US2011133330A1Low temperature curing compositionsHENKEL CORP·Filed 2011·Application pending·0 cites
- 1045US2011129673A1Silver-coated boron nitride particulate materials and formulations containing sameHENKEL CORP·Filed 2009·Application pending·0 cites
- 1136US2018280242A1Anaesthetic carrierUVAMED LTD·Filed 2015·Application pending·0 cites
- 1231US9449938B2Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereofHenkel IP & Holding GmbH·Filed 2016·Granted Sep 20, 2016·0 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →