Inventor · disambiguated record
Randall J. Stutzman
Also filed as: STUTZMAN RANDALL · STUTZMAN RANDALL J · STUTZMAN RANDALL JOSEPH
26 granted patents·978 citations·filing 1990–2017
97Inventor score
Top patents by PatentIndex Score
26 records- 0196US6665187B1Thermally enhanced lid for multichip modulesIBM·Filed 2002·Granted Dec 16, 2003·108 cites·18 claims
- 0296US6665186B1Liquid metal thermal interface for an electronic moduleIBM·Filed 2002·Granted Dec 16, 2003·138 cites·22 claims
- 0394US6552266B2High performance chip packaging and methodIBM·Filed 2001·Granted Apr 22, 2003·96 cites·12 claims
- 0493US7324336B2Flow through cooling assemblies for conduction-cooled circuit modulesLOCKHEED CORP·Filed 2005·Granted Jan 29, 2008·42 cites·17 claims
- 0592US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0687US10371462B2Integrated multi-chamber heat exchangerLOCKHEED CORP·Filed 2015·Granted Aug 6, 2019·5 cites·14 claims
- 0787US6744132B2Module with adhesively attached heat sinkIBM·Filed 2002·Granted Jun 1, 2004·46 cites·9 claims
- 0886US6235994B1Thermal/electrical break for printed circuit boardsIBM·Filed 1998·Granted May 22, 2001·67 cites·24 claims
- 0985US6830960B2Stress-relieving heatsink structure and method of attachment to an electronic packageIBM·Filed 2002·Granted Dec 14, 2004·34 cites·12 claims
- 1085US6541847B1Packaging for multi-processor shared-memory systemIBM·Filed 2002·Granted Apr 1, 2003·36 cites·20 claims
- 1185US6212076B1Enhanced heat-dissipating printed circuit board packageIBM·Filed 1999·Granted Apr 3, 2001·61 cites·29 claims
- 1284US5003429AElectronic assembly with enhanced heat sinkingIBM·Filed 1990·Granted Mar 26, 1991·60 cites·17 claims
- 1383US10461018B2Integrated multi-chamber heat exchangerLOCKHEED CORP·Filed 2017·Granted Oct 29, 2019·3 cites·4 claims
- 1481US7186590B2Thermally enhanced lid for multichip modulesIBM·Filed 2003·Granted Mar 6, 2007·26 cites·20 claims
- 1578US6675852B2Platen for use in laminating pressIBM·Filed 2001·Granted Jan 13, 2004·14 cites·9 claims
- 1676US6691769B2Heat sink for convection cooling in horizontal applicationsIBM·Filed 2001·Granted Feb 17, 2004·20 cites·18 claims
- 1775US6883593B2Heat sink for convection cooling in horizontal applicationsIBM·Filed 2004·Granted Apr 26, 2005·18 cites·25 claims
- 1875US6455924B1Stress-relieving heatsink structure and method of attachment to an electronic packageIBM·Filed 2001·Granted Sep 24, 2002·19 cites·22 claims
- 1974US6829144B1Flip chip package with heat spreader allowing multiple heat sink attachmentIBM·Filed 2003·Granted Dec 7, 2004·20 cites·20 claims
- 2073US9357670B2Efficient heat transfer from conduction-cooled circuit cardsLOCKHEED CORP·Filed 2014·Granted May 31, 2016·4 cites·20 claims
- 2173US5251095ALow temperature conduction module for a cryogenically-cooled processorIBM·Filed 1992·Granted Oct 5, 1993·42 cites·8 claims
- 2270US10914535B2Integrated multi-chamber heat exchangerLOCKHEED CORP·Filed 2017·Granted Feb 9, 2021·1 cites·4 claims
- 2366US6949415B2Module with adhesively attached heat sinkIBM·Filed 2004·Granted Sep 27, 2005·12 cites·8 claims
- 2444US6552264B2High performance chip packaging and methodIBM·Filed 1998·Granted Apr 22, 2003·9 cites·8 claims
- 2540US6793123B2Packaging for multi-processor shared-memory systemIBM·Filed 2003·Granted Sep 21, 2004·0 cites·20 claims
- 2638US6655020B2Method of packaging a high performance chipIBM·Filed 2001·Granted Dec 2, 2003·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →