Inventor · disambiguated record
Feng-Lung Chien
Also filed as: CHIEN FENG-LUNG
20 granted patents·6 pending applications·138 citations·filing 2000–2023
93Inventor score
Files withTDK TAIWAN CORP16SILICONWARE PRECISION INDUSTRIES CO LTD7CHIEN FENG-LUNG1LIN YI HUNG1SILICONEWARE PREC IND CO LTD1
Top patents by PatentIndex Score
26 records- 0185US12160112B2Wireless transmission moduleTDK TAIWAN CORP·Filed 2022·Granted Dec 3, 2024·2 cites·21 claims
- 0284US7489037B2Semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Feb 10, 2009·15 cites·14 claims
- 0382US6348401B1Method of fabricating solder bumps with high coplanarity for flip-chip applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 19, 2002·38 cites·9 claims
- 0479US8569162B2Conductive bump structure on substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Oct 29, 2013·5 cites·9 claims
- 0577US6258705B1Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chipSILICONEWARE PREC IND CO LTD·Filed 2000·Granted Jul 10, 2001·27 cites·4 claims
- 0676US8866293B2Semiconductor structure and fabrication method thereofLIN YI-HUNG·Filed 2011·Granted Oct 21, 2014·4 cites·7 claims
- 0771US6692629B1Flip-chip bumbing method for fabricating solder bumps on semiconductor waferSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 17, 2004·16 cites·17 claims
- 0870US9793743B2Wireless charging device for charging a plurality of wireless power receiving apparatus and charging method thereofTDK TAIWAN CORP·Filed 2015·Granted Oct 17, 2017·3 cites·35 claims
- 0970US9595383B2Wireless charging coil PCB structureTDK TAIWAN CORP·Filed 2015·Granted Mar 14, 2017·3 cites·9 claims
- 1069US11050298B2Wireless deviceTDK TAIWAN CORP·Filed 2018·Granted Jun 29, 2021·1 cites·10 claims
- 1169US6753609B2Circuit probing contact pad formed on a bond pad in a flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 22, 2004·13 cites·3 claims
- 1267US12224108B2Coil moduleTDK TAIWAN CORP·Filed 2023·Granted Feb 11, 2025·0 cites·16 claims
- 1365US11936198B2Coil moduleTDK TAIWAN CORP·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 1461US12506366B2Wireless transmission moduleTDK TAIWAN CORP·Filed 2022·Granted Dec 23, 2025·0 cites·19 claims
- 1555US10615629B2Wireless deviceTDK TAIWAN CORP·Filed 2018·Granted Apr 7, 2020·0 cites·16 claims
- 1654US7341949B2Process for forming lead-free bump on electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 11, 2008·11 cites·17 claims
- 1753US11581132B2Magnetic conductive substrate and coil assemblyTDK TAIWAN CORP·Filed 2019·Granted Feb 14, 2023·0 cites·14 claims
- 1852US11817253B2Coil moduleTDK TAIWAN CORP·Filed 2020·Granted Nov 14, 2023·0 cites·12 claims
- 1952US10840738B2Wireless deviceTDK TAIWAN CORP·Filed 2018·Granted Nov 17, 2020·0 cites·19 claims
- 2052US2024062945A1Wireless transmission moduleTDK TAIWAN CORP·Filed 2023·Application pending·0 cites
- 2151US2015072517A1Fabrication method of semiconductor structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2250US2022277886A1Coil moduleTDK TAIWAN CORP·Filed 2021·Application pending·0 cites
- 2348US10855108B2Wireless deviceTDK TAIWAN CORP·Filed 2018·Granted Dec 1, 2020·0 cites·12 claims
- 2437US2012126397A1Semiconductor substrate and method thereofCHIEN FENG-LUNG·Filed 2011·Application pending·0 cites
- 2531US2016126001A1Wireless charging coil pcb structure with slitTDK TAIWAN CORP·Filed 2015·Application pending·0 cites
- 2629US2016126002A1Wireless Charging and Near Field Communication Dual Coils PCB StructureTDK TAIWAN CORP·Filed 2015·Application pending·0 cites
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