Inventor · disambiguated record
Angelo Kandas
Also filed as: KANDAS ANGELO · KANDAS ANGELO W
5 granted patents·4 pending applications·108 citations·filing 1998–2024
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0183US10818774B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2017·Granted Oct 27, 2020·1 cites·12 claims
- 0282US6406995B1Pattern-sensitive deposition for damascene processingINTEL CORP·Filed 1999·Granted Jun 18, 2002·72 cites·30 claims
- 0376US11404559B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Granted Aug 2, 2022·0 cites·21 claims
- 0475US2025098258A1Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2024·Application pending·0 cites
- 0568US12199168B2Plugs for interconnect lines for advanced integrated circuit structure fabricationINTEL CORP·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 0666US6649515B2Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structuresINTEL CORP·Filed 1998·Granted Nov 18, 2003·35 cites·14 claims
- 0757US2025210509A1Single damascene via profiles for advanced integrated circuit structure fabricationINTEL CORP·Filed 2023·Application pending·0 cites
- 0857US2025218931A1Interconnect via with induced asymmetric profileINTEL CORP·Filed 2023·Application pending·0 cites
- 0936US2008079166A1Managing forces of semiconductor device layersLEE KEVIN J·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →