Inventor · disambiguated record
Steve Xin Liang
Also filed as: LIANG STEVE X · LIANG STEVE XIN
6 granted patents·5 pending applications·105 citations·filing 2005–2014
84Inventor score
Files withSKYWORKS SOLUTIONS INC6JIANGSU CHANGJIANG ELECTRONICS3JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD1LIANG STEVE XIN1
Top patents by PatentIndex Score
11 records- 0193US7629201B2Method for fabricating a wafer level package with device wafer and passive component integrationSKYWORKS SOLUTIONS INC·Filed 2007·Granted Dec 8, 2009·27 cites·20 claims
- 0293US7576426B2Wafer level package including a device wafer integrated with a passive componentSKYWORKS SOLUTIONS INC·Filed 2005·Granted Aug 18, 2009·31 cites·16 claims
- 0391US9153551B2Integrated circuit package including in-situ formed cavitySKYWORKS SOLUTIONS INC·Filed 2014·Granted Oct 6, 2015·14 cites·20 claims
- 0484US8900931B2In-situ cavity integrated circuit packageLIANG STEVE XIN·Filed 2007·Granted Dec 2, 2014·19 cites·17 claims
- 0582US7642135B2Thermal mechanical flip chip die bondingSKYWORKS SOLUTIONS INC·Filed 2007·Granted Jan 5, 2010·13 cites·18 claims
- 0650US9640413B2Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted May 2, 2017·1 cites·19 claims
- 0745US2008217708A1Integrated passive cap in a system-in-packageSKYWORKS SOLUTIONS INC·Filed 2008·Application pending·0 cites
- 0836US2007070608A1Packaged electronic devices and process of manufacturing sameSKYWORKS SOLUTIONS INC·Filed 2005·Application pending·0 cites
- 0935US2016148861A1First-packaged and later-etched three-dimensional flip-chip system-in-package structure and processing method thereforJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
- 1033US2016141233A1First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Application pending·0 cites
- 1133US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →