Inventor · disambiguated record
Gil Provent
Also filed as: PROVENT GIL
2 granted patents·1 pending application·8 citations·filing 2008–2014
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0171US8227332B2Method for fabricating electrical bonding pads on a waferCOFFY ROMAIN·Filed 2008·Granted Jul 24, 2012·8 cites·9 claims
- 0240US8148258B2Method for fabricating electrical bonding pads on a waferCOFFY ROMAIN·Filed 2008·Granted Apr 3, 2012·0 cites·6 claims
- 0339US2015022987A1Electronic device comprising an integrated circuit chip provided with projecting electrical connection padsST MICROELECTRONICS CROLLES 2·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →