Inventor · disambiguated record
Jacky Seiller
Also filed as: SEILLER JACKY
3 granted patents·1 pending application·11 citations·filing 2004–2008
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0171US8227332B2Method for fabricating electrical bonding pads on a waferCOFFY ROMAIN·Filed 2008·Granted Jul 24, 2012·8 cites·9 claims
- 0241US2008157273A1Integrated electronic circuit chip comprising an inductorST MICROELECTRONICS SA·Filed 2007·Application pending·0 cites
- 0340US8148258B2Method for fabricating electrical bonding pads on a waferCOFFY ROMAIN·Filed 2008·Granted Apr 3, 2012·0 cites·6 claims
- 0435US7919864B2Forming of the last metallization level of an integrated circuitST MICROELECTRONICS SA·Filed 2004·Granted Apr 5, 2011·3 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Jacky Seiller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →