Inventor · disambiguated record
Hunteak Lee
Also filed as: LEE HUNTEAK
45 granted patents·8 pending applications·119 citations·filing 2007–2025
97Inventor score
Files withSTATS CHIPPAC PTE LTD39STATS CHIPPAC LTD8JCET STATS CHIPPAC KOREA LTD2PAGAILA REZA A2LEE HUNTEAK1
Top patents by PatentIndex Score
53 records- 0195US10388637B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·24 claims
- 0294US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0394US10937741B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Mar 2, 2021·10 cites·25 claims
- 0493US11189598B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2019·Granted Nov 30, 2021·7 cites·25 claims
- 0593US10468384B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 5, 2019·7 cites·24 claims
- 0692US8039384B2Semiconductor device and method of forming vertically offset bond on trace interconnects on different height tracesSTATS CHIPPAC LTD·Filed 2010·Granted Oct 18, 2011·13 cites·25 claims
- 0791US11887863B2Double-sided partial molded SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jan 30, 2024·2 cites·19 claims
- 0891US10797039B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 6, 2020·6 cites·21 claims
- 0990US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 1090US10700011B2Semiconductor device and method of forming an integrated SIP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 30, 2020·7 cites·22 claims
- 1189US10636774B2Semiconductor device and method of forming a 3D integrated system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·5 cites·23 claims
- 1288US8563418B2Semiconductor device and method of forming vertically offset bond on trace interconnects on different height tracesPAGAILA REZA A·Filed 2011·Granted Oct 22, 2013·8 cites·24 claims
- 1387US9287204B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2013·Granted Mar 15, 2016·8 cites·25 claims
- 1486US9252130B2Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Feb 2, 2016·10 cites·27 claims
- 1585US10636756B2Semiconductor device and method of forming protrusion E-bar for 3D SIPSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 28, 2020·4 cites·25 claims
- 1682US12385128B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·24 claims
- 1781US12046564B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1881US8409978B2Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframePAGAILA REZA A·Filed 2010·Granted Apr 2, 2013·5 cites·25 claims
- 1980US2025023227A1Antenna-in-Package Devices and Methods of MakingSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 2079US12266614B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·25 claims
- 2179US9236332B2Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframeSTATS CHIPPAC LTD·Filed 2013·Granted Jan 12, 2016·4 cites·23 claims
- 2279US2025201730A1Molded Laser Package with Electromagnetic Interference Shield and Method of MakingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2378US12211803B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·22 claims
- 2476US12374559B2Double-sided partial molded SiP moduleSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 29, 2025·0 cites·18 claims
- 2576US11676911B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·22 claims
- 2675US12211808B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·25 claims
- 2775US11932933B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·0 cites·23 claims
- 2875US9721921B2Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer formSTATS CHIPPAC LTD·Filed 2016·Granted Aug 1, 2017·2 cites·23 claims
- 2974US2023411831A1Antenna module, semiconductor device and methods for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 3073US12136759B2Antenna-in-package devices and methods of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 5, 2024·0 cites·23 claims
- 3173US11652088B2Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 16, 2023·0 cites·24 claims
- 3273US8524537B2Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residueYUN JAEUN·Filed 2010·Granted Sep 3, 2013·4 cites·28 claims
- 3372US11587882B2Molded laser package with electromagnetic interference shield and method of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 3468US11894314B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 6, 2024·0 cites·25 claims
- 3568US11434561B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 6, 2022·0 cites·24 claims
- 3667US10804119B2Method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 13, 2020·1 cites·18 claims
- 3765US11842991B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2020·Granted Dec 12, 2023·0 cites·21 claims
- 3865US11735539B2Semiconductor device and method of forming discrete antenna modulesSTATS CHIPPAC PTE LTD·Filed 2020·Granted Aug 22, 2023·0 cites·17 claims
- 3965US11367690B2Semiconductor device and method of forming an integrated SiP module with embedded inductor or packageSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 21, 2022·0 cites·23 claims
- 4065US10790268B2Semiconductor device and method of forming a 3D integrated system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 29, 2020·0 cites·25 claims
- 4164US11309193B2Semiconductor device and method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2020·Granted Apr 19, 2022·0 cites·18 claims
- 4263US11244908B2Method and device for reducing metal burrs when sawing semiconductor packagesSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 8, 2022·0 cites·25 claims
- 4360US11342294B2Semiconductor device and method of forming protrusion e-bar for 3D SiPSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·0 cites·22 claims
- 4460US7868468B2Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substratesSTATS CHIPPAC LTD·Filed 2007·Granted Jan 11, 2011·1 cites·9 claims
- 4560US2024290671A1Semiconductor package with improved space utilization and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4659US9524958B2Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bondingSTATS CHIPPAC LTD·Filed 2013·Granted Dec 20, 2016·1 cites·26 claims
- 4759US8936969B2Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tapeLEE HUNTEAK·Filed 2012·Granted Jan 20, 2015·2 cites·24 claims
- 4858US2025105162A1Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating LayerJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 4958US2023402400A1Partially shieded semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 5056US12304122B2Semiconductor manufacturing device and method of enhancing mold gate injector and air vent to reduce voids in encapsulantSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 20, 2025·0 cites·26 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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