Inventor · disambiguated record
Jung-Hyun Shin
Also filed as: SHIN JUNG HYUN
17 granted patents·9 pending applications·144 citations·filing 1990–2023
92Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11HS R & A CO LTD3SK HYNIX INC3GENED CO LTD2HEWLETT PACKARD DEVELOPMENT CO2
Top patents by PatentIndex Score
26 records- 0179US11236714B2Resonator having excellent airtightnessHS R & A CO LTD·Filed 2019·Granted Feb 1, 2022·2 cites·2 claims
- 0274US12113650B2Semiconductor apparatus including calibration circuitSK HYNIX INC·Filed 2023·Granted Oct 8, 2024·0 cites·18 claims
- 0370US12257654B2Jig device for laser welding and jig system including the sameHS R & A CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·12 claims
- 0470US2024194906A1Fuel cell system and exhaust gas treatment deviceHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0568US5005103AMethod of manufacturing folded capacitors in semiconductor and folded capacitors fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 1990·Granted Apr 2, 1991·30 cites·14 claims
- 0667US11792052B2Semiconductor apparatus including calibration circuitSK HYNIX INC·Filed 2022·Granted Oct 17, 2023·0 cites·21 claims
- 0767US9883066B2Method and device for performing printing operation through communication service of image forming apparatusS PRINTING SOLUTION CO LTD·Filed 2016·Granted Jan 30, 2018·2 cites·20 claims
- 0865US7439102B2Semiconductor fuse box and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 21, 2008·2 cites·12 claims
- 0965US7145196B2Asymmetric field effect transistorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 5, 2006·10 cites·12 claims
- 1061US5073510AFabrication method of contact window in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1990·Granted Dec 17, 1991·31 cites·13 claims
- 1159US5502336ASemiconductor device and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Mar 26, 1996·23 cites·10 claims
- 1257US7442613B2Methods of forming an asymmetric field effect transistorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 28, 2008·1 cites·17 claims
- 1357US5818091ASemiconductor device with selectively patterned connection pad layer for increasing a contact marginSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Oct 6, 1998·15 cites·17 claims
- 1457US2023320171A1Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Application pending·0 cites
- 1556US2008045120A1Stuffed toysMOON SUNG JOO·Filed 2006·Application pending·0 cites
- 1654US7750432B2Semiconductor fuse box and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jul 6, 2010·0 cites·17 claims
- 1753US5484739AMethod for manufacturing a CMOS semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Jan 16, 1996·13 cites·10 claims
- 1851US5591670AMethod of manufacturing a semiconductor device having self aligned contact holeSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Jan 7, 1997·15 cites·5 claims
- 1948US2020173589A1Quick Connector AssemblyHS R & A CO LTD·Filed 2019·Application pending·0 cites
- 2047US2023120954A1Cleaning member control based on information detected by paper detection sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 2142US7154160B2Semiconductor fuse box and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 26, 2006·0 cites·9 claims
- 2241US10847194B2Input/output circuit and memory device having the sameSK HYNIX INC·Filed 2018·Granted Nov 24, 2020·0 cites·20 claims
- 2341US2020393495A1Replaceable double-type probe pinGENED CO LTD·Filed 2020·Application pending·0 cites
- 2441US2020393494A1Replaceable single-type probe pinGENED CO LTD·Filed 2020·Application pending·0 cites
- 2536US2023022271A1Media sensor of image forming device for compensating transmitted light amount based on temperature dataHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 2635US2005106808A1Semiconductor devices having at least one storage node and methods of fabricating the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →