Inventor · disambiguated record
Gaurav Hada
Also filed as: HADA GAURAV
2 granted patents·1 pending application·0 citations·filing 2021–2023
23Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0153US12300918B2Memory module connector for thin computing systemsINTEL CORP·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 0252US12025971B2Socket interposer for system-in-package (SIP) module qualification in product platform validation (PPV) setupINTEL CORP·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 0349US2024334715A1For memory on package with reduced thicknessINTEL CORP·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gaurav Hada files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →