Inventor · disambiguated record
Andrew Perkins
Also filed as: PERKINS ANDREW · PERKINS ANDREW E · PERKINS ANDREW EUGENE
33 granted patents·5 pending applications·559 citations·filing 2000–2023
97Inventor score
Files withFREE FLOW PACKAGING INT INC14SEMICONDUCTOR COMPONENTS IND LLC11FREE FLOW PACKAGING INTERNAT I3SEMICONDUCTOR COMPONENTS IND3BORTHAKUR SWARNAL2
Top patents by PatentIndex Score
38 records- 0198US7223462B2Film material for air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2006·Granted May 29, 2007·38 cites·6 claims
- 0298US6659150B1Apparatus for inflating and sealing air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2000·Granted Dec 9, 2003·188 cites·23 claims
- 0398US6565946B2Web of film formed with a pattern of pillows to be inflated and sealed and used in packagingFREE FLOW PACKAGING INT INC·Filed 2002·Granted May 20, 2003·86 cites·1 claims
- 0496US10797090B2Image sensor with near-infrared and visible light phase detection pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 6, 2020·8 cites·20 claims
- 0596US6605169B2Method of making air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2002·Granted Aug 12, 2003·44 cites·9 claims
- 0694US9497366B1Imaging systems with integrated light shield structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 15, 2016·14 cites·20 claims
- 0794US7361397B2Film material for air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2006·Granted Apr 22, 2008·11 cites·4 claims
- 0892US11652176B2Semiconductor devices with single-photon avalanche diodes and light scattering structures with different densitiesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 0992US9883128B2Imaging systems with high dynamic range and phase detection pixelsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 30, 2018·10 cites·15 claims
- 1088US7185474B2Machine for inflating and sealing air filled cushioning materialsFREE FLOW PACKAGING INT INC·Filed 2006·Granted Mar 6, 2007·16 cites·7 claims
- 1188US7059097B2Apparatus for inflating and sealing air-filled packing cushionsFREE FLOW PACKAGING INTERNAT I·Filed 2003·Granted Jun 13, 2006·17 cites·30 claims
- 1285US9041840B2Backside illuminated image sensors with stacked diesSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted May 26, 2015·8 cites·17 claims
- 1383US8697473B2Methods for forming backside illuminated image sensors with front side metal redistribution layersBORTHAKUR SWARNAL·Filed 2011·Granted Apr 15, 2014·6 cites·9 claims
- 1483US7150136B2Machine and method for inflating and sealing air filled packing cushionsFREE FLOW PACKAGING INTERNAT I·Filed 2006·Granted Dec 19, 2006·7 cites·4 claims
- 1582USD599118SInflatable packing materialFREE FLOW PACKAGING INT INC·Filed 2007·Granted Sep 1, 2009·32 cites·1 claims
- 1681US9998643B2Methods of forming curved image sensorsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Jun 12, 2018·3 cites·11 claims
- 1781US7174696B2Machine and method for inflating and sealing air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2002·Granted Feb 13, 2007·15 cites·15 claims
- 1881US7090912B2Film material for air-filled packing cushionsFREE FLOW PACKAGING INTERNAT I·Filed 2003·Granted Aug 15, 2006·9 cites·9 claims
- 1979US7832562B2Apparatus for inflating and sealing air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2009·Granted Nov 16, 2010·3 cites·4 claims
- 2079USRE40288EApparatus for inflating and sealing air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2005·Granted May 6, 2008·2 cites·23 claims
- 2178US7536837B2Apparatus for inflating and sealing pillows in packaging cushionsFREE FLOW PACKAGING INT INC·Filed 2000·Granted May 26, 2009·7 cites·14 claims
- 2275US7645628B2Method and system for fabricating semiconductor components with lens structures and lens support structuresAPTINA IMAGING CORP·Filed 2006·Granted Jan 12, 2010·7 cites·42 claims
- 2372US7040073B2Machine for inflating and sealing air-filled cushioning materialsFREE FLOW PACKAGING INTERNAT·Filed 2004·Granted May 9, 2006·16 cites·24 claims
- 2469US12113138B2Semiconductor devices with single-photon avalanche diodes and light scattering structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 8, 2024·0 cites·19 claims
- 2569US8323774B2Apparatus for inflating and sealing pillows in packaging cushionsPERKINS ANDREW·Filed 2011·Granted Dec 4, 2012·1 cites·9 claims
- 2667US10854665B2Semiconductor device and method of forming curved image sensor region robust against bucklingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 2764US9362330B2Methods for forming backside illuminated image sensors with front side metal redistribution layers and a permanent carrier layerSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 7, 2016·1 cites·12 claims
- 2863US9269743B2Methods of forming imaging device layers using carrier substratesSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Feb 23, 2016·0 cites·8 claims
- 2962US9635228B2Image sensors with interconnects in cover layerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Apr 25, 2017·1 cites·7 claims
- 3062US9003743B2Apparatus for inflating and sealing pillows in packaging cushionsPERKINS ANDREW·Filed 2009·Granted Apr 14, 2015·1 cites·8 claims
- 3158US7343723B2Method and apparatus for pre-tearing strings of air-filled packing materials and the likeFREE FLOW PACKAGING INT INC·Filed 2004·Granted Mar 18, 2008·6 cites·19 claims
- 3255US2006218876A1Apparatus for Inflating and Sealing Pillows in Packaging CushionsFREE FLOW PACKAGING INT INC·Filed 2006·Application pending·0 cites
- 3353US10056428B2Semiconductor device and method of forming curved image sensor region robust against bucklingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Aug 21, 2018·0 cites·16 claims
- 3453US9666638B2Methods for forming backside illuminated image sensors with front side metal redistribution layersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 30, 2017·0 cites·20 claims
- 3553US2012193744A1Imagers with buried metal trenches and though-silicon viasBORTHAKUR SWARNAL·Filed 2011·Application pending·0 cites
- 3652US2023197750A1Single-photon avalanche diode covered by multiple microlensesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Application pending·0 cites
- 3750US2005236295A1Film material for air-filled packing cushionsFREE FLOW PACKAGING INT INC·Filed 2005·Application pending·0 cites
- 3838US2012194719A1Image sensor units with stacked image sensors and image processorsCHURCHWELL SCOTT·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →