Inventor · disambiguated record
Heidi Lan
Also filed as: LAN HEIDI
6 granted patents·2 pending applications·4 citations·filing 2018–2023
68Inventor score
Files withDISCO CORP8
Top patents by PatentIndex Score
8 records- 0174US10784166B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 22, 2020·2 cites·4 claims
- 0272US10707129B2Processing method of waferDISCO CORP·Filed 2018·Granted Jul 7, 2020·2 cites·4 claims
- 0352US2023260854A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 0450US11724352B2Wafer processing methodDISCO CORP·Filed 2021·Granted Aug 15, 2023·0 cites·2 claims
- 0548US2022068694A1Wafer processing methodDISCO CORP·Filed 2021·Application pending·0 cites
- 0643US10991622B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·7 claims
- 0741US10991623B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·3 claims
- 0840US11024542B2Manufacturing method of device chipDISCO CORP·Filed 2019·Granted Jun 1, 2021·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →