Inventor · disambiguated record
Seishi Eya
Also filed as: EYA SEISHI
3 granted patents·36 citations·filing 2002–2004
69Inventor score
Top patents by PatentIndex Score
3 records- 0173US7168058B2Printed circuit wiring board designing support device, printed circuit board designing method, and its programNEC CORP·Filed 2004·Granted Jan 23, 2007·22 cites·30 claims
- 0262US6774641B2Printed circuit board design support apparatus, method, and programNEC CORP·Filed 2002·Granted Aug 10, 2004·10 cites·21 claims
- 0343US7216327B2Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the methodNEC INFORMATEC SYSTEMS LTD·Filed 2004·Granted May 8, 2007·4 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Seishi Eya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →