Inventor · disambiguated record

Fu-Bin Song

Also filed as: SONG FU-BIN

1 granted patent·1 pending application·21 citations·filing 2004–2005

40Inventor score

Technology areasH10W

Files withFREESCALE SEMICONDUCTOR INC1 SONG FU-BIN1

Top patents by PatentIndex Score

2 records

0184US7554185B2Flip chip and wire bond semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jun 30, 2009·21 cites·9 claims
0230US2006038266A1QFN package and method thereforSONG FU-BIN·Filed 2004·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →