Inventor · disambiguated record
Rui Huang
Also filed as: HUANG RUI · HUANG RUI-CHENG
90 granted patents·3 pending applications·1,310 citations·filing 2006–2018
99Inventor score
Top patents by PatentIndex Score
93 records- 0198US9524955B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2012·Granted Dec 20, 2016·49 cites·5 claims
- 0298US8354304B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Jan 15, 2013·69 cites·25 claims
- 0398US7902644B2Integrated circuit package system for electromagnetic isolationSTATS CHIPPAC LTD·Filed 2007·Granted Mar 8, 2011·95 cites·18 claims
- 0498US7799602B2Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structureSTATS CHIPPAC LTD·Filed 2008·Granted Sep 21, 2010·72 cites·20 claims
- 0598US7772046B2Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interferenceSTATS CHIPPAC LTD·Filed 2008·Granted Aug 10, 2010·81 cites·19 claims
- 0698US7618846B1Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the deviceSTATS CHIPPAC LTD·Filed 2008·Granted Nov 17, 2009·92 cites·19 claims
- 0797US8354746B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2011·Granted Jan 15, 2013·34 cites·26 claims
- 0897US8072059B2Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor dieSHIM IL KWON·Filed 2009·Granted Dec 6, 2011·54 cites·25 claims
- 0997US7989270B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsSTATS CHIPPAC LTD·Filed 2009·Granted Aug 2, 2011·45 cites·24 claims
- 1096US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 1196US8101460B2Semiconductor device and method of shielding semiconductor die from inter-device interferencePAGAILA REZA A·Filed 2008·Granted Jan 24, 2012·44 cites·25 claims
- 1295US9385009B2Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSPLIN YAOJIAN·Filed 2011·Granted Jul 5, 2016·55 cites·24 claims
- 1395US8476120B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2012·Granted Jul 2, 2013·16 cites·35 claims
- 1495US7880275B2Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the deviceSTATS CHIPPAC LTD·Filed 2009·Granted Feb 1, 2011·34 cites·25 claims
- 1595US7666709B1Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patternsSTATS CHIPPAC LTD·Filed 2008·Granted Feb 23, 2010·40 cites·22 claims
- 1694US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 1794US8456002B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefLIN YAOJIAN·Filed 2011·Granted Jun 4, 2013·13 cites·25 claims
- 1894US8304880B2Integrated circuit packaging system with package-on-package and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Nov 6, 2012·22 cites·20 claims
- 1993US8624364B2Integrated circuit packaging system with encapsulation connector and method of manufacture thereofCHOW SENG GUAN·Filed 2010·Granted Jan 7, 2014·17 cites·20 claims
- 2093US7701040B2Semiconductor package and method of reducing electromagnetic interference between devicesSTATS CHIPPAC LTD·Filed 2007·Granted Apr 20, 2010·27 cites·21 claims
- 2192US8269320B2Integrated circuit package system for electromagnetic isolation and method for manufacturing thereofHUANG RUI·Filed 2011·Granted Sep 18, 2012·12 cites·18 claims
- 2292US8076757B2Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interferencePAGAILA REZA A·Filed 2010·Granted Dec 13, 2011·13 cites·25 claims
- 2392US7993941B2Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Aug 9, 2011·20 cites·27 claims
- 2492US7989269B2Semiconductor package with penetrable encapsulant joining semiconductor die and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·20 cites·25 claims
- 2590US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 2690US8178956B2Integrated circuit package system for shielding electromagnetic interferenceDO BYUNG TAI·Filed 2007·Granted May 15, 2012·19 cites·20 claims
- 2790US7923846B2Integrated circuit package-in-package system with wire-in-film encapsulantSTATS CHIPPAC LTD·Filed 2008·Granted Apr 12, 2011·13 cites·9 claims
- 2887US9099455B2Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulantSTATS CHIPPAC LTD·Filed 2012·Granted Aug 4, 2015·7 cites·32 claims
- 2987US8790962B2Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structureSTATS CHIPPAC LTD·Filed 2013·Granted Jul 29, 2014·6 cites·24 claims
- 3087US8405228B2Integrated circuit packaging system with package underfill and method of manufacture thereofHUANG RUI·Filed 2009·Granted Mar 26, 2013·13 cites·9 claims
- 3186US8163597B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2009·Granted Apr 24, 2012·12 cites·31 claims
- 3286US8138024B2Package system for shielding semiconductor dies from electromagnetic interferenceDO BYUNG TAI·Filed 2008·Granted Mar 20, 2012·14 cites·20 claims
- 3386US8084302B2Semiconductor package having semiconductor die with internal vertical interconnect structure and method thereforDO BYUNG TAI·Filed 2008·Granted Dec 27, 2011·10 cites·36 claims
- 3485US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 3585US8507319B2Integrated circuit package system with shieldCHOW SENG GUAN·Filed 2007·Granted Aug 13, 2013·13 cites·20 claims
- 3685US8399305B2Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assistHUANG RUI·Filed 2010·Granted Mar 19, 2013·11 cites·28 claims
- 3785US8159047B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2011·Granted Apr 17, 2012·6 cites·23 claims
- 3884US8421212B2Integrated circuit packaging system with active surface heat removal and method of manufacture thereofCHEN KANG·Filed 2010·Granted Apr 16, 2013·8 cites·18 claims
- 3983US8368188B2Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereofSTATS CHIPPAC LTD·Filed 2010·Granted Feb 5, 2013·4 cites·3 claims
- 4083US7732252B2Multi-chip package system incorporating an internal stacking module with support protrusionsSTATS CHIPPAC LTD·Filed 2008·Granted Jun 8, 2010·11 cites·20 claims
- 4182US9666500B2Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress reliefSTATS CHIPPAC LTD·Filed 2015·Granted May 30, 2017·2 cites·22 claims
- 4282US9275877B2Semiconductor device and method of forming semiconductor package using panel form carrierLIN YAOJIAN·Filed 2011·Granted Mar 1, 2016·6 cites·25 claims
- 4382US8455991B2Integrated circuit packaging system with warpage control and method of manufacture thereofHSIAO YUNG KUAN·Filed 2010·Granted Jun 4, 2013·10 cites·14 claims
- 4482US8299596B2Integrated circuit packaging system with bump conductors and method of manufacture thereofHUANG RUI·Filed 2010·Granted Oct 30, 2012·6 cites·20 claims
- 4582US8258612B2Encapsulant interposer system with integrated passive devices and manufacturing method thereforKUAN HEAP HOE·Filed 2010·Granted Sep 4, 2012·5 cites·19 claims
- 4682US7834430B2Drop-mold conformable material as an encapsulation for an integrated circuit package systemSTATS CHIPPAC LTD·Filed 2008·Granted Nov 16, 2010·6 cites·17 claims
- 4782US7812449B2Integrated circuit package system with redistribution layerSTATS CHIPPAC LTD·Filed 2008·Granted Oct 12, 2010·8 cites·18 claims
- 4881US10170385B2Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSPSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 1, 2019·3 cites·21 claims
- 4980US8436439B2Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structurePAGAILA REZA A·Filed 2010·Granted May 7, 2013·4 cites·25 claims
- 5080US7863109B2Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jan 4, 2011·9 cites·20 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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