Inventor · disambiguated record
Manjula Variyam
Also filed as: VARIYAM MANJULA N
5 granted patents·1 pending application·54 citations·filing 2002–2007
79Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC5
Top patents by PatentIndex Score
6 records- 0178US6696644B1Polymer-embedded solder bumps for reliable plastic package attachmentTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 24, 2004·25 cites·11 claims
- 0275US7294451B2Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit boardTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 13, 2007·20 cites·10 claims
- 0349US7679190B2Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit boardTEXAS INSTRUMENTS INC·Filed 2007·Granted Mar 16, 2010·0 cites·8 claims
- 0448US7085699B2Wire bonding simulationTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 1, 2006·5 cites·20 claims
- 0547US6953707B2Method and system for chip-to-package interconnectionTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 11, 2005·4 cites·18 claims
- 0637US2004149479A1Polymer-embedded solder bumps for reliable plastic package attachmentFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →