Inventor · disambiguated record
Dave Pratt
Also filed as: PRATT DAVE
21 granted patents·1 pending application·149 citations·filing 2001–2024
93Inventor score
Top patents by PatentIndex Score
22 records- 0193US7821107B2Die stacking with an annular via having a recessed socketMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 26, 2010·23 cites·19 claims
- 0291US7952171B2Die stacking with an annular via having a recessed socketMICRON TECHNOLOGY INC·Filed 2010·Granted May 31, 2011·10 cites·14 claims
- 0390US6718371B1XML-based integrated services frameworkNOVELL INC·Filed 2001·Granted Apr 6, 2004·83 cites·20 claims
- 0489US9136259B2Method of creating alignment/centering guides for small diameter, high density through-wafer via die stackingPRATT DAVE·Filed 2008·Granted Sep 15, 2015·21 cites·18 claims
- 0582US12438083B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 0681US11328749B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2019·Granted May 10, 2022·3 cites·20 claims
- 0777US8546919B2Die stacking with an annular via having a recessed socketPRATT DAVE·Filed 2012·Granted Oct 1, 2013·3 cites·10 claims
- 0875US12014983B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 18, 2024·0 cites·9 claims
- 0974US9828069B2Mooring systemNAUTRICITY LTD·Filed 2013·Granted Nov 28, 2017·4 cites·30 claims
- 1067US11482492B2Assemblies having conductive interconnects which are laterally and vertically offset relative to one anotherMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 25, 2022·0 cites·29 claims
- 1165US8227343B2Die stacking with an annular via having a recessed socketPRATT DAVE·Filed 2011·Granted Jul 24, 2012·1 cites·18 claims
- 1264US12463129B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·21 claims
- 1364US8531046B2Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backsidePRATT DAVE·Filed 2011·Granted Sep 10, 2013·1 cites·18 claims
- 1463US11978527B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 1560US10685882B2Methods of forming through substrate interconnectsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 16, 2020·0 cites·13 claims
- 1660US9685375B2Methods of forming through substrate interconnectsMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 20, 2017·0 cites·14 claims
- 1758US8927410B2Methods of forming through substrate interconnectsMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 6, 2015·0 cites·16 claims
- 1857US11545391B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·58 claims
- 1955US8034702B2Methods of forming through substrate interconnectsMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 11, 2011·0 cites·23 claims
- 2053US8629060B2Methods of forming through substrate interconnectsPRATT DAVE·Filed 2011·Granted Jan 14, 2014·0 cites·21 claims
- 2151US7955946B2Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 7, 2011·0 cites·42 claims
- 2239US2006068753A1Emergency call handling systemKARPEN JIM·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →