Inventor · disambiguated record
Hideaki Yoshimura
Also filed as: YOSHIMURA HIDEAKI
38 granted patents·17 pending applications·335 citations·filing 1994–2015
97Inventor score
Top patents by PatentIndex Score
55 records- 0189US8110749B2Printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 7, 2012·20 cites·4 claims
- 0288US9107314B2Method of manufacturing a wiring board having via structuresFUJITSU LTD·Filed 2013·Granted Aug 11, 2015·7 cites·4 claims
- 0384US7381592B2Method of making a semiconductor device with improved heat dissipationFUJITSU LTD·Filed 2007·Granted Jun 3, 2008·9 cites·2 claims
- 0482US7115444B2Semiconductor device with improved heat dissipation, and a method of making semiconductor deviceFUJITSU LTD·Filed 2005·Granted Oct 3, 2006·8 cites·1 claims
- 0582US6576317B2Optical disc and injection compression molding die for producing the sameSONY CORP·Filed 2001·Granted Jun 10, 2003·16 cites·10 claims
- 0681US6560173B2Servo control apparatus for optical disc playerPIONEER CORP·Filed 2001·Granted May 6, 2003·17 cites·8 claims
- 0780US8878076B2Wiring substrate and manufacturing method for wiring substrateFUJITSU LTD·Filed 2012·Granted Nov 4, 2014·4 cites·5 claims
- 0880US8800142B2Package substrate unit and method for manufacturing package substrate unitNANG HNIN NWAY SAN·Filed 2011·Granted Aug 12, 2014·10 cites·2 claims
- 0980US8023268B2Printed circuit board unit and semiconductor packageFUJITSU LTD·Filed 2009·Granted Sep 20, 2011·9 cites·4 claims
- 1079US7260806B2Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding programFUJITSU LTD·Filed 2005·Granted Aug 21, 2007·8 cites·17 claims
- 1178US8152953B2Method of making printed wiring board and method of making printed circuit board unitYOSHIMURA HIDEAKI·Filed 2009·Granted Apr 10, 2012·8 cites·6 claims
- 1278US5894882AHeat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structureFUJITSU LTD·Filed 1996·Granted Apr 20, 1999·60 cites·17 claims
- 1377US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 1476US8151456B2Method of producing substrateMAEHARA YASUTOMO·Filed 2008·Granted Apr 10, 2012·9 cites·5 claims
- 1576US6777657B2Focusing controller for focus jump control between recording layers of multilayer diskPIONEER CORP·Filed 2002·Granted Aug 17, 2004·13 cites·6 claims
- 1675US8754333B2Printed circuit board incorporating fibersYOSHIMURA HIDEAKI·Filed 2011·Granted Jun 17, 2014·4 cites·7 claims
- 1774US5926445AWaveform controlling device for a tracking error signalPIONEER ELECTRONIC CORP·Filed 1996·Granted Jul 20, 1999·27 cites·10 claims
- 1874US5751674AApparatus for controlling bias amount of focus error signalPIONEER ELECTRONIC CORP·Filed 1996·Granted May 12, 1998·28 cites·8 claims
- 1973US6334569B1Reflow soldering apparatus and reflow soldering methodFUJITSU LTD·Filed 2000·Granted Jan 1, 2002·17 cites·12 claims
- 2069US7999193B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 16, 2011·3 cites·14 claims
- 2167US8161636B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted Apr 24, 2012·3 cites·5 claims
- 2266US8186053B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted May 29, 2012·4 cites·5 claims
- 2365US8035037B2Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·2 cites·10 claims
- 2463US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 2563US8119925B2Core substrate and printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 21, 2012·2 cites·7 claims
- 2662US7304389B2Semiconductor device and supporting plateFUJITSU LTD·Filed 2005·Granted Dec 4, 2007·2 cites·4 claims
- 2762US6646962B2Apparatus for detecting dropout, an error signal extracting unit, and unit for identifying type of dropout in an optical pickupPIONEER CORP·Filed 2001·Granted Nov 11, 2003·5 cites·7 claims
- 2861US7222316B2Board design aiding apparatus, board design aiding method and board design aiding programFUJITSU LTD·Filed 2004·Granted May 22, 2007·8 cites·15 claims
- 2959US6879554B2Disc player capable of reproducing a partially recorded discPIONEER CORP·Filed 2000·Granted Apr 12, 2005·4 cites·58 claims
- 3059US2009098391A1Core member and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3158US6841103B2Injection molding apparatus and methodSONY DISC TECHNOLOGY INC·Filed 2001·Granted Jan 11, 2005·3 cites·6 claims
- 3257US8669481B2Laminated circuit board and board producing methodYOSHIMURA HIDEAKI·Filed 2011·Granted Mar 11, 2014·1 cites·3 claims
- 3355US7199467B2Semiconductor device with improved heat dissipation, and a method of making semiconductor deviceFUJITSU LTD·Filed 2004·Granted Apr 3, 2007·4 cites·9 claims
- 3451US8119923B2Circuit boardYOSHIMURA HIDEAKI·Filed 2008·Granted Feb 21, 2012·0 cites·4 claims
- 3551US2015305157A1Method of manufacturing a wiring board having via structuresFUJITSU LTD·Filed 2015·Application pending·0 cites
- 3651US2010018758A1Printed wiring boardFUJITSU LTD·Filed 2009·Application pending·0 cites
- 3751US2007012477A1Electronic component package including joint material having higher heat conductivityFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3851US2010018762A1Buildup printed circuit boardFUJITSU LTD·Filed 2009·Application pending·0 cites
- 3950US2009294160A1Method of making printed wiring board and electrically-conductive binderFUJITSU LTD·Filed 2009·Application pending·0 cites
- 4049US8586876B2Laminated circuit board and board producing methodYOSHIMURA HIDEAKI·Filed 2011·Granted Nov 19, 2013·0 cites·13 claims
- 4149US6600705B2Method of and apparatus for setting servo adjustment value, reproducing information and recording information under servo control using servo adjustment valuePIONEER CORP·Filed 2000·Granted Jul 29, 2003·1 cites·16 claims
- 4249US2009095509A1Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4347US6970402B1Carrier mechanismPIONEER CORP·Filed 2000·Granted Nov 29, 2005·1 cites·25 claims
- 4445US2012211270A1Method of manufacturing printed wiring board and printed wiring boardYOSHIMURA HIDEAKI·Filed 2012·Application pending·0 cites
- 4544US2011303444A1Laminated circuit board, bonding sheet, laminated-circuit-board producing method, and bonding -sheet producing methodYOSHIMURA HIDEAKI·Filed 2011·Application pending·0 cites
- 4643US2012024586A1Printed wiring board, method for manufacturing the same, and electronic equipmentYOSHIMURA HIDEAKI·Filed 2011·Application pending·0 cites
- 4742US2008006915A1Semiconductor package, method of production of same, printed circuit board, and electronic apparatusFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4842US2008053618A1Optical Recording Medium-Producing SheetSONY DISC & DIGITAL SOLUTIONS·Filed 2005·Application pending·0 cites
- 4940US2014294009A1Communication apparatus, communication system, control method of communication apparatus and programSONY CORP·Filed 2014·Application pending·0 cites
- 5040US2003063537A1Disk reproducerPIONEER CORP·Filed 2002·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →