Inventor · disambiguated record
Allan P. Ilagan
Also filed as: ILAGAN ALLAN · ILAGAN ALLAN P · ILAGAN ALLAN PUMATONG
10 granted patents·1 pending application·125 citations·filing 2006–2024
88Inventor score
Technology areasH10W
Files withSTATS CHIPPAC LTD3UTAC HEADQUARTERS PTE LTD3ESPIRITU EMMANUEL2CAMACHO ZIGMUND RAMIREZ1DO BYUNG TAI1
Top patents by PatentIndex Score
11 records- 0197US7518226B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2007·Granted Apr 14, 2009·78 cites·12 claims
- 0287US8026129B2Stacked integrated circuits package system with passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 27, 2011·16 cites·20 claims
- 0382US9305809B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofESPIRITU EMMANUEL·Filed 2014·Granted Apr 5, 2016·6 cites·20 claims
- 0482US7911046B2Integrated circuit packaging system with interposerSTATS CHIPPAC LTD·Filed 2009·Granted Mar 22, 2011·9 cites·17 claims
- 0578US8395254B2Integrated circuit package system with heatspreaderESPIRITU EMMANUEL·Filed 2006·Granted Mar 12, 2013·9 cites·20 claims
- 0675US2025126909A1Reliable semiconductors packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 0765US8138080B2Integrated circuit package system having interconnect stack and external interconnectFILOTEO JR DARIO S·Filed 2006·Granted Mar 20, 2012·4 cites·20 claims
- 0864US9048228B2Integrated circuit packaging system with side solderable leads and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jun 2, 2015·2 cites·20 claims
- 0963US12211863B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 1058US8304921B2Integrated circuit packaging system with interconnect and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Nov 6, 2012·1 cites·20 claims
- 1149US12021096B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →