Inventor · disambiguated record
Min-Lin Lee
Also filed as: LEE MIN-LIN
44 granted patents·8 pending applications·389 citations·filing 2001–2021
98Inventor score
Top patents by PatentIndex Score
52 records- 0196US6717071B2Coaxial via hole and process of fabricating the sameIND TECH RES INST·Filed 2001·Granted Apr 6, 2004·123 cites·16 claims
- 0292US9125304B2Circuit board having via and manufacturing method thereofIND TECH RES INST·Filed 2014·Granted Sep 1, 2015·11 cites·19 claims
- 0392US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0491US8035951B2Capacitor devicesIND TECH RES INST·Filed 2010·Granted Oct 11, 2011·13 cites·2 claims
- 0590US9706656B2Signal transmission board and method for manufacturing the sameIND TECH RES INST·Filed 2015·Granted Jul 11, 2017·9 cites·21 claims
- 0690US7561410B1Hybrid capacitorIND TECH RES INST·Filed 2008·Granted Jul 14, 2009·21 cites·28 claims
- 0789US8094429B2Multilayer capacitors and methods for making the sameHSU CHIEN-MIN·Filed 2009·Granted Jan 10, 2012·18 cites·27 claims
- 0884US7894172B2ESD protection structureIND TECH RES INST·Filed 2008·Granted Feb 22, 2011·14 cites·28 claims
- 0984US7742276B2Wiring structure of laminated capacitorsIND TECH RES INST·Filed 2007·Granted Jun 22, 2010·12 cites·19 claims
- 1084US7345366B2Apparatus and method for testing component built in circuit boardIND TECH RES INST·Filed 2005·Granted Mar 18, 2008·10 cites·22 claims
- 1183US7804678B2Capacitor devicesIND TECH RES INST·Filed 2007·Granted Sep 28, 2010·9 cites·14 claims
- 1283US7714590B2Method for testing component built in circuit boardIND TECH RES INST·Filed 2007·Granted May 11, 2010·9 cites·11 claims
- 1382US7102876B2Structure of an interleaving striped capacitor substrateIND TECH RES INST·Filed 2005·Granted Sep 5, 2006·10 cites·18 claims
- 1480US7764512B2Mirror image shielding structureIND TECH RES INST·Filed 2006·Granted Jul 27, 2010·7 cites·8 claims
- 1578US7349196B2Composite distributed dielectric structureIND TECH RES INST·Filed 2005·Granted Mar 25, 2008·8 cites·23 claims
- 1676US8488299B2Capacitor structureWU SHIH-HSIEN·Filed 2010·Granted Jul 16, 2013·4 cites·13 claims
- 1776US8289679B2Decoupling deviceCHENG CHENG-LIANG·Filed 2010·Granted Oct 16, 2012·3 cites·38 claims
- 1876US7894178B2Through hole capacitor and method of manufacturing the sameIND TECH RES INST·Filed 2008·Granted Feb 22, 2011·6 cites·33 claims
- 1975US9013893B2Embedded capacitor moduleIND TECH RES INST·Filed 2013·Granted Apr 21, 2015·4 cites·35 claims
- 2075US7649723B2ESD protection substrate and integrated circuit utilizing the sameIND TECH RES INST·Filed 2008·Granted Jan 19, 2010·7 cites·18 claims
- 2174US7515435B2Multi-functional composite substrate structureIND TECH RES INST·Filed 2006·Granted Apr 7, 2009·5 cites·21 claims
- 2273US8174840B2Multi-functional composite substrate structureJOW UEI-MING·Filed 2008·Granted May 8, 2012·5 cites·41 claims
- 2371US8179695B2Mirror image shielding structureJOW UEI-MING·Filed 2010·Granted May 15, 2012·2 cites·16 claims
- 2468US8125761B2Capacitor devices with co-coupling electrode planesHSU CHIEN-MIN·Filed 2009·Granted Feb 28, 2012·4 cites·23 claims
- 2567US9258883B2Via structureIND TECH RES INST·Filed 2015·Granted Feb 9, 2016·1 cites·9 claims
- 2667US8071890B2Electrically conductive structure of circuit board and circuit board using the sameHSU CHIEN-MIN·Filed 2008·Granted Dec 6, 2011·3 cites·22 claims
- 2765US6683781B2Packaging structure with low switching noisesIND TECH RES INST·Filed 2002·Granted Jan 27, 2004·13 cites·20 claims
- 2864US8941015B2Embedded capacitor substrate moduleHSU CHIEN-MIN·Filed 2011·Granted Jan 27, 2015·1 cites·23 claims
- 2964US8035036B2Complementary mirror image embedded planar resistor architectureIND TECH RES INST·Filed 2007·Granted Oct 11, 2011·2 cites·12 claims
- 3064US7893359B2Embedded capacitor core having a multiple-layer structureIND TECH RES INST·Filed 2006·Granted Feb 22, 2011·2 cites·15 claims
- 3163US7875808B2Embedded capacitor device having a common coupling areaIND TECH RES INST·Filed 2006·Granted Jan 25, 2011·2 cites·19 claims
- 3255US8198538B2Capacitor devices having multi-sectional conductorsHSU CHIEN-MIN·Filed 2009·Granted Jun 12, 2012·2 cites·14 claims
- 3354US8227894B2Stepwise capacitor structure and substrate employing the sameLEE MIN-LIN·Filed 2009·Granted Jul 24, 2012·2 cites·41 claims
- 3452US6683469B2Regulable test integrated circuit system for signal noise and method of using sameIND TECH RES INST·Filed 2001·Granted Jan 27, 2004·5 cites·5 claims
- 3551US8049512B2Circuit board with embedded components and manufacturing and measuring method thereofIND TECH RES INST·Filed 2007·Granted Nov 1, 2011·1 cites·6 claims
- 3651US2009210055A1Artificial optic nerve network module, artificial retina chip module, and method for fabricating the sameIND TECH RES INST·Filed 2008·Application pending·0 cites
- 3747US9030808B2Solid electrolytic capacitor and circuit board having the sameHSU CHIEN-MIN·Filed 2012·Granted May 12, 2015·0 cites·18 claims
- 3845US2009128993A1Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the sameIND TECHNOLOGY REASERCH INST·Filed 2008·Application pending·0 cites
- 3944US12185456B2Circuit board with rigid portion and flexible portion having connecting end and electronic package using the sameFIRST HI TEC ENTPR CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·18 claims
- 4043US9029984B2Semiconductor substrate assemblyIND TECH RES INST·Filed 2013·Granted May 12, 2015·0 cites·11 claims
- 4142US8026603B2Interconnect structure of an integrated circuit and manufacturing method thereofIND TECH RES INST·Filed 2006·Granted Sep 27, 2011·0 cites·12 claims
- 4242US7308377B2Test method of embedded capacitor and test system thereofIND TECH RES INST·Filed 2006·Granted Dec 11, 2007·0 cites·42 claims
- 4342US2009002916A1Interdigital capacitorIND TECH RES INST·Filed 2007·Application pending·0 cites
- 4441US2004149490A1Coaxial via hole and process of fabricating the sameFiled 2004·Application pending·0 cites
- 4539US2003184953A1Structure of an interleaving striped capacitor substrateFiled 2003·Application pending·0 cites
- 4637US10559534B2Circuit substrateIND TECH RES INST·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 4736US2002047772A1Electrical-resistant via hole and process of fabricating the sameFiled 2001·Application pending·0 cites
- 4836US2004211954A1Compositive laminate substrate with inorganic substrate and organic substrateFiled 2003·Application pending·0 cites
- 4934US10129974B2Multi-layer circuit structureIND TECH RES INST·Filed 2016·Granted Nov 13, 2018·0 cites·14 claims
- 5034US8237520B2Capacitor devices with a filter structureCHANG HUEY-RU·Filed 2009·Granted Aug 7, 2012·0 cites·24 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →