Inventor · disambiguated record
Akira Fukuizumi
Also filed as: FUKUIZUMI AKIRA
5 granted patents·146 citations·filing 2001–2003
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0189US6849930B2Semiconductor device with uneven metal plate to improve adhesion to molding compoundNEC CORP·Filed 2001·Granted Feb 1, 2005·60 cites·13 claims
- 0283US6720647B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2001·Granted Apr 13, 2004·47 cites·5 claims
- 0370US6613829B2Conductive hardening resin for a semiconductor device and semiconductor device using the sameNEC ELECTRONICS CORP·Filed 2002·Granted Sep 2, 2003·18 cites·13 claims
- 0465US6747360B2Conductive hardening resin for a semiconductor device and semiconductor device using the sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 8, 2004·13 cites·16 claims
- 0555US6733695B2Electrically conductive paste and semiconductor device prepared by using the pasteSUMITOMO BAKELITE CO·Filed 2002·Granted May 11, 2004·8 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →