Inventor · disambiguated record
Tek Seng Tan
Also filed as: TAN TEK SENG
5 granted patents·1 pending application·66 citations·filing 2004–2009
82Inventor score
Top patents by PatentIndex Score
6 records- 0187US7651938B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2006·Granted Jan 26, 2010·15 cites·18 claims
- 0283US7999394B2Void reduction in indium thermal interface materialADVANCED MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·10 cites·19 claims
- 0381US7622311B1Inspection of underfill in integrated circuit packageADVANCED MICRO DEVICES INC·Filed 2005·Granted Nov 24, 2009·19 cites·22 claims
- 0476US7256067B1LGA fixture for indium assembly processADVANCED MICRO DEVICES INC·Filed 2006·Granted Aug 14, 2007·9 cites·18 claims
- 0562US7256065B1Methods and fixture for coupling a lid to a support substrateADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 14, 2007·13 cites·5 claims
- 0640US2010055848A1Inspection of underfill in integrated circuit packageCHA KENG SANG·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →