Inventor · disambiguated record
Toru Nishino
Also filed as: NISHINO TORU
16 granted patents·3 pending applications·167 citations·filing 1980–2022
93Inventor score
Top patents by PatentIndex Score
19 records- 0193US4341560AWaterproof gypsum molded productKURASHIKI BOSEKI KK·Filed 1980·Granted Jul 27, 1982·62 cites·8 claims
- 0292US10403525B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2017·Granted Sep 3, 2019·7 cites·9 claims
- 0378US4330589AFoamed gypsum moulded articles and production thereofKURASHIKI BOSEKI KK·Filed 1981·Granted May 18, 1982·29 cites·11 claims
- 0474US7145250B2LSI package, LSI element testing method, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2005·Granted Dec 5, 2006·6 cites·20 claims
- 0572US8925188B2Component mounting apparatusNISHINO TORU·Filed 2010·Granted Jan 6, 2015·3 cites·8 claims
- 0671US7790499B2Observation apparatus and method for observing void in underfill resinFUJITSU LTD·Filed 2007·Granted Sep 7, 2010·6 cites·8 claims
- 0769US7056770B2Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin materialFUJITSU LTD·Filed 2003·Granted Jun 6, 2006·19 cites·9 claims
- 0865US7795552B2Contact piece member, contactor and contact methodFUJITSU SEMICONDUCTOR LTD·Filed 2007·Granted Sep 14, 2010·4 cites·2 claims
- 0965US6776745B2Toner supply rollerNITTO KOGYO KK·Filed 2003·Granted Aug 17, 2004·9 cites·10 claims
- 1061US8471901B2Image input module adjusting device and image input module adjusting methodNISHINO TORU·Filed 2008·Granted Jun 25, 2013·1 cites·2 claims
- 1160US7276924B2Electrical connecting methodFUJITSU LTD·Filed 2004·Granted Oct 2, 2007·8 cites·10 claims
- 1259US11069548B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2019·Granted Jul 20, 2021·0 cites·8 claims
- 1355US7157311B2Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devicesFUJITSU LTD·Filed 2003·Granted Jan 2, 2007·5 cites·15 claims
- 1453USD287835SMotor tricycleHONDA MOTOR CO LTD·Filed 1984·Granted Jan 20, 1987·5 cites·1 claims
- 1550US2023135548A1Information processing apparatus, information processing method, and information processing programFUJIFILM CORP·Filed 2022·Application pending·0 cites
- 1649US2014053589A1Heat storage type radiation air conditioning system employing heat pump air-conditionerINTERCENTRAL CO LTD·Filed 2013·Application pending·0 cites
- 1748US2007065653A1Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devicesFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1844US7152322B2Toner supply rollerKURASHIKI BOSEKI KK·Filed 2004·Granted Dec 26, 2006·3 cites·13 claims
- 1937US8769810B2Part mounting methodNISHINO TORU·Filed 2010·Granted Jul 8, 2014·0 cites·7 claims
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