Inventor · disambiguated record
Randall S. Mundt
Also filed as: MUNDT RANDALL · MUNDT RANDALL S
37 granted patents·2,170 citations·filing 1978–2014
98Inventor score
Top patents by PatentIndex Score
37 records- 0198US5846373AMethod for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamberLAM RES CORP·Filed 1996·Granted Dec 8, 1998·221 cites·18 claims
- 0296US6691068B1Methods and apparatus for obtaining data for process operation, optimization, monitoring, and controlONWAFER TECHNOLOGIES INC·Filed 2000·Granted Feb 10, 2004·148 cites·41 claims
- 0396US5200232AReaction chamber design and method to minimize particle generation in chemical vapor deposition reactorsLAM RES CORP·Filed 1990·Granted Apr 6, 1993·132 cites·12 claims
- 0496US4571819AMethod for forming trench isolation structuresNCR CO·Filed 1984·Granted Feb 25, 1986·226 cites·16 claims
- 0594US6542835B2Data collection methods and apparatusONWAFER TECHNOLOGIES INC·Filed 2001·Granted Apr 1, 2003·90 cites·27 claims
- 0694US5262029AMethod and system for clamping semiconductor wafersLAM RESEARCH·Filed 1989·Granted Nov 16, 1993·188 cites·8 claims
- 0793US6160621AMethod and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light sourceLAM RES CORP·Filed 1999·Granted Dec 12, 2000·108 cites·31 claims
- 0893US4578128AProcess for forming retrograde dopant distributions utilizing simultaneous outdiffusion of dopantsNCR CO·Filed 1984·Granted Mar 25, 1986·185 cites·8 claims
- 0992US4297162APlasma etching using improved electrodeTEXAS INSTRUMENTS INC·Filed 1979·Granted Oct 27, 1981·90 cites·14 claims
- 1089US7960670B2Methods of and apparatuses for measuring electrical parameters of a plasma processKLA TENCOR CORP·Filed 2005·Granted Jun 14, 2011·13 cites·18 claims
- 1189US5472565ATopology induced plasma enhancement for etched uniformity improvementLAM RES CORP·Filed 1993·Granted Dec 5, 1995·53 cites·18 claims
- 1289US5137701AApparatus and method for eliminating unwanted materials from a gas flow lineMUNDT RANDALL S·Filed 1984·Granted Aug 11, 1992·62 cites·8 claims
- 1388US5463526AHybrid electrostatic chuckLAM RES CORP·Filed 1994·Granted Oct 31, 1995·111 cites·18 claims
- 1485US6907364B2Methods and apparatus for deriving thermal flux data for processing a workpieceONWAFER TECHNOLOGIES INC·Filed 2003·Granted Jun 14, 2005·41 cites·21 claims
- 1583US4671970ATrench filling and planarization processNCR CO·Filed 1986·Granted Jun 9, 1987·83 cites·11 claims
- 1682US7127362B2Process tolerant methods and apparatus for obtaining dataMUNDT RANDALL S·Filed 2004·Granted Oct 24, 2006·19 cites·20 claims
- 1781US4656497ATrench isolation structuresNCR CO·Filed 1985·Granted Apr 7, 1987·62 cites·3 claims
- 1880US7531984B2Sensor apparatus power transfer, communication and maintenance methods and apparatusKLA TENCOR CORP·Filed 2006·Granted May 12, 2009·15 cites·17 claims
- 1980US5644400AMethod and apparatus for determining the center and orientation of a wafer-like objectLAM RES CORP·Filed 1996·Granted Jul 1, 1997·62 cites·19 claims
- 2077US8698037B2Methods of and apparatuses for maintenance, diagnosis, and optimization of processesMUNDT RANDALL S·Filed 2011·Granted Apr 15, 2014·3 cites·7 claims
- 2176US6642063B2Apparatus for characterization of microelectronic feature qualityLAM RES CORP·Filed 2002·Granted Nov 4, 2003·16 cites·29 claims
- 2275US7482576B2Apparatuses for and methods of monitoring optical radiation parameters for substrate processing operationsKLA TENCOR CORP·Filed 2006·Granted Jan 27, 2009·8 cites·25 claims
- 2374US7722434B2Apparatus for measurement of parameters in process equipmentKLA TENCOR CORP·Filed 2006·Granted May 25, 2010·5 cites·33 claims
- 2474US4170492AMethod of selective oxidation in manufacture of semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1978·Granted Oct 9, 1979·30 cites·6 claims
- 2572US7282889B2Maintenance unit for a sensor apparatusONWAFER TECHNOLOGIES INC·Filed 2004·Granted Oct 16, 2007·24 cites·37 claims
- 2670US5718511ATemperature mapping methodLAM RES CORP·Filed 1995·Granted Feb 17, 1998·22 cites·27 claims
- 2768US5368646AReaction chamber design to minimize particle generation in chemical vapor deposition reactorsLAM RES CORP·Filed 1994·Granted Nov 29, 1994·23 cites·28 claims
- 2866US6432729B1Method for characterization of microelectronic feature qualityLAM RES CORP·Filed 1999·Granted Aug 13, 2002·28 cites·7 claims
- 2964US6878301B2Methods and apparatuses for trench depth detection and controlLAM RES·Filed 2003·Granted Apr 12, 2005·7 cites·20 claims
- 3062US5654796AApparatus and method for mapping plasma characteristicsLAM RES CORP·Filed 1995·Granted Aug 5, 1997·24 cites·20 claims
- 3160USRE39145EMethod and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light sourceLAM RES CORP·Filed 2003·Granted Jun 27, 2006·8 cites·31 claims
- 3258US9029728B2Methods of and apparatuses for measuring electrical parameters of a plasma processKLA TENCOR CORP·Filed 2014·Granted May 12, 2015·0 cites·14 claims
- 3358US5714031ATopology induced plasma enhancement for etched uniformity improvementLAM RES CORP·Filed 1995·Granted Feb 3, 1998·11 cites·19 claims
- 3453US5702533AParticulate free vacuum compatible pinch sealLAM RES CORP·Filed 1996·Granted Dec 30, 1997·19 cites·19 claims
- 3550US6582619B1Methods and apparatuses for trench depth detection and controlLAM RES CORP·Filed 1999·Granted Jun 24, 2003·13 cites·6 claims
- 3646US5791850AVacuum compatible fastener and fastening systemLAM RES CORP·Filed 1996·Granted Aug 11, 1998·19 cites·27 claims
- 3743US6719456B2Methods and apparatus for firefightingFiled 2001·Granted Apr 13, 2004·1 cites·15 claims
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