Inventor · disambiguated record
Frank Zudock
Also filed as: ZUDOCK FRANK
4 granted patents·4 pending applications·39 citations·filing 2009–2024
72Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG2INTEL CORP2GANESAN SANKA1INFINEON TECHNOLOGIES AG1MEYER THORSTEN1
Top patents by PatentIndex Score
8 records- 0190US8093711B2Semiconductor deviceZUDOCK FRANK·Filed 2009·Granted Jan 10, 2012·32 cites·22 claims
- 0279US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 0372US9472515B2Integrated circuit packageINTEL CORP·Filed 2014·Granted Oct 18, 2016·2 cites·13 claims
- 0459US2024266237A1A semiconductor transistor package having electrical contact layers and a method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0554US2024030200A1Semiconductor package and methodINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0652US10157869B2Integrated circuit packageINTEL CORP·Filed 2016·Granted Dec 18, 2018·0 cites·10 claims
- 0748US2023117806A1Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0843US2015187608A1Die package architecture with embedded die and simplified redistribution layerGANESAN SANKA·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →