Inventor · disambiguated record
Wing Cheng
Also filed as: CHENG WING · CHENG WING L · CHENG WING LAU
15 granted patents·4 pending applications·938 citations·filing 1999–2012
95Inventor score
Top patents by PatentIndex Score
19 records- 0197US6310755B1Electrostatic chuck having gas cavity and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 30, 2001·325 cites·38 claims
- 0296US6538872B1Electrostatic chuck having heater and methodAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·123 cites·18 claims
- 0394US6490146B2Electrostatic chuck bonded to base with a bond layer and methodAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·88 cites·28 claims
- 0493US6503368B1Substrate support having bonded sections and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jan 7, 2003·76 cites·22 claims
- 0592US6676760B2Process chamber having multiple gas distributors and methodAPPILED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·55 cites·22 claims
- 0691US7221553B2Substrate support having heat transfer systemAPPLIED MATERIALS INC·Filed 2003·Granted May 22, 2007·49 cites·23 claims
- 0791US6583980B1Substrate support tolerant to thermal expansion stressesAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·60 cites·44 claims
- 0888US8279577B2Substrate support having fluid channelNGUYEN ANDREW·Filed 2010·Granted Oct 2, 2012·8 cites·32 claims
- 0985US6795292B2Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamberFiled 2001·Granted Sep 21, 2004·41 cites·26 claims
- 1084US7768765B2Substrate support having heat transfer systemAPPLIED MATERIALS INC·Filed 2007·Granted Aug 3, 2010·8 cites·32 claims
- 1183US6462928B1Electrostatic chuck having improved electrical connector and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 8, 2002·65 cites·13 claims
- 1276US6572814B2Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gasAPPLIED MATERIALS INC·Filed 2001·Granted Jun 3, 2003·21 cites·15 claims
- 1369US8146902B2Hybrid composite wafer carrier for wet clean equipmentCHENG WING LAU·Filed 2007·Granted Apr 3, 2012·3 cites·16 claims
- 1467US6736668B1High temperature electrical connectorFiled 2000·Granted May 18, 2004·16 cites·22 claims
- 1548US8292697B2Method for manufacturing a hybrid composite wafer carrier for wet clean equipmentCHENG WING LAU·Filed 2012·Granted Oct 23, 2012·0 cites·19 claims
- 1643US2008038448A1Chemical resistant semiconductor processing chamber bodiesLAM RES CORP·Filed 2007·Application pending·0 cites
- 1737US2003192646A1Plasma processing chamber having magnetic assembly and methodAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1830US2002036881A1Electrostatic chuck having composite base and methodFiled 1999·Application pending·0 cites
- 1929US2002022403A1Connectors for an eletrostatic chuckFiled 1999·Application pending·0 cites
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