Inventor · disambiguated record
Chiyo Horikawa
Also filed as: HORIKAWA CHIYO
3 granted patents·1 pending application·40 citations·filing 2003–2008
70Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0181US6849099B2Polishing compositionFUJIMI INC·Filed 2003·Granted Feb 1, 2005·28 cites·15 claims
- 0265US7189684B2Polishing composition and method for forming wiring structure using the sameFUJIMI INC·Filed 2003·Granted Mar 13, 2007·10 cites·18 claims
- 0360US8501027B2Polishing composition and polishing methodHORIKAWA CHIYO·Filed 2008·Granted Aug 6, 2013·2 cites·12 claims
- 0444US2005191823A1Polishing composition and polishing methodFiled 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →