Inventor · disambiguated record
Shaw Wei Lee
Also filed as: LEE SHAW W · LEE SHAW WEI
25 granted patents·2 pending applications·972 citations·filing 1995–2009
97Inventor score
Top patents by PatentIndex Score
27 records- 0195US5620928AUltra thin ball grid array using a flex tape or printed wiring board substrate and methodNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 15, 1997·119 cites·21 claims
- 0294US6723585B1Leadless packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Apr 20, 2004·111 cites·14 claims
- 0389US5686842AKnown good die test apparatus and methodNAT SEMICONDUCTOR CORP·Filed 1995·Granted Nov 11, 1997·75 cites·13 claims
- 0489US5652185AMaximized substrate design for grid array based assembliesNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 29, 1997·117 cites·16 claims
- 0588US7795126B2Electrical die contact structure and fabrication methodNAT SEMICONDUCTOR CORP·Filed 2008·Granted Sep 14, 2010·12 cites·24 claims
- 0686US5620927ASolder ball attachment machine for semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 15, 1997·79 cites·13 claims
- 0785US7846775B1Universal lead frame for micro-array packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Dec 7, 2010·15 cites·13 claims
- 0884US7419855B1Apparatus and method for miniature semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Sep 2, 2008·11 cites·18 claims
- 0984US6551859B1Chip scale and land grid array semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2001·Granted Apr 22, 2003·41 cites·15 claims
- 1082US7087986B1Solder pad configuration for use in a micro-array integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 8, 2006·33 cites·19 claims
- 1181US6933212B1Apparatus and method for dicing semiconductor wafersNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·25 cites·19 claims
- 1281US6873024B1Apparatus and method for wafer level packaging of optical imaging semiconductor devicesEASTMAN KODAK CO·Filed 2002·Granted Mar 29, 2005·30 cites·14 claims
- 1380US7161232B1Apparatus and method for miniature semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jan 9, 2007·26 cites·15 claims
- 1478US6173490B1Method for forming a panel of packaged integrated circuitsNAT SEMICONDUCTOR CORP·Filed 1997·Granted Jan 16, 2001·59 cites·21 claims
- 1568US6362530B1Manufacturing methods and construction for integrated circuit packagesNAT SEMICONDUCTOR CORP·Filed 1998·Granted Mar 26, 2002·37 cites·11 claims
- 1668US5783866ALow cost ball grid array device and method of manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jul 21, 1998·32 cites·9 claims
- 1766US6396135B1Substrate for use in semiconductor packagingNAT SEMICONDUCTOR CORP·Filed 2000·Granted May 28, 2002·16 cites·15 claims
- 1864US7205095B1Apparatus and method for packaging image sensing semiconductor chipsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Apr 17, 2007·10 cites·10 claims
- 1964US5796586ASubstrate board having an anti-adhesive solder maskNAT SEMICONDUCTOR INC·Filed 1996·Granted Aug 18, 1998·36 cites·23 claims
- 2063US6054338ALow cost ball grid array device and method of manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1998·Granted Apr 25, 2000·26 cites·4 claims
- 2161US7340181B1Electrical die contact structure and fabrication methodNAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 4, 2008·7 cites·11 claims
- 2256US6284566B1Chip scale package and method for manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1999·Granted Sep 4, 2001·20 cites·13 claims
- 2351US6278618B1Substrate strips for use in integrated circuit packagingNAT SEMICONDUCTOR CORP·Filed 1999·Granted Aug 21, 2001·21 cites·19 claims
- 2447US6140708AChip scale package and method for manufacture thereofNAT SEMICONDUCTOR CORP·Filed 1997·Granted Oct 31, 2000·13 cites·16 claims
- 2546US2010015329A1Methods and systems for packaging integrated circuits with thin metal contactsNAT SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 2645US8093707B2Leadframe packages having enhanced ground-bond reliabilityLEE SHAW WEI·Filed 2009·Granted Jan 10, 2012·1 cites·15 claims
- 2745US2011140253A1Dap ground bond enhancementNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →