Inventor · disambiguated record
Tetsuo Okuyama
Also filed as: OKUYAMA TETSUO
31 granted patents·18 pending applications·929 citations·filing 1987–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0198US5641997APlastic-encapsulated semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jun 24, 1997·442 cites·20 claims
- 0294US5922115ADecolorizable ink and printerTOSHIBA KK·Filed 1997·Granted Jul 13, 1999·85 cites·6 claims
- 0391US6017386ADecolorizable ink and printerTOSHIBA KK·Filed 1999·Granted Jan 25, 2000·63 cites·21 claims
- 0483US4794463AInk jet systemTOSHIBA KK·Filed 1987·Granted Dec 27, 1988·35 cites·38 claims
- 0581US8980409B2Laminate, method for producing same, and method for producing device structure using sameOKUYAMA TETSUO·Filed 2012·Granted Mar 17, 2015·6 cites·16 claims
- 0677US5849651AReversible thermal recording mediumTOSHIBA KK·Filed 1996·Granted Dec 15, 1998·27 cites·24 claims
- 0776US6054222AEpoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tabletTOSHIBA KK·Filed 1998·Granted Apr 25, 2000·52 cites·20 claims
- 0875US2025019508A1Layered body including inorganic substrate and polyamic acid cured productTOYO BOSEKI·Filed 2024·Application pending·0 cites
- 0974US11267216B2Polymer film laminated substrate and method for producing flexible electronic deviceTOYO BOSEKI·Filed 2018·Granted Mar 8, 2022·2 cites·9 claims
- 1074US6332834B1Method and apparatus for grinding a workpieceNIPPEI TOYAMA CORP·Filed 2000·Granted Dec 25, 2001·18 cites·23 claims
- 1173US12172409B2Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport methodTOYO BOSEKI·Filed 2022·Granted Dec 24, 2024·0 cites·17 claims
- 1273US9895868B2Method for producing layered product, layered product, method for producing layered product with device using said layered product, and layered product with deviceTOYO BOSEKI·Filed 2013·Granted Feb 20, 2018·2 cites·7 claims
- 1373US6375742B2Apparatus for processing paper sheets to decolor an image formed thereonTOSHIBA KK·Filed 1999·Granted Apr 23, 2002·30 cites·4 claims
- 1472US9604391B2Laminate, production method for same, and method of creating device structure using laminateTAMADA MASAHIRO·Filed 2012·Granted Mar 28, 2017·5 cites·9 claims
- 1571US6228688B1Flip-chip resin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1998·Granted May 8, 2001·41 cites·15 claims
- 1668US6277208B1Method of decoloring an image forming material formed on a paper sheetTOSHIBA KK·Filed 1999·Granted Aug 21, 2001·18 cites·19 claims
- 1767US12391813B2Layered body including inorganic substrate and polyamic acid cured productTOYO BOSEKI·Filed 2021·Granted Aug 19, 2025·0 cites·18 claims
- 1866US12479194B2LaminateTOYO BOSEKI·Filed 2022·Granted Nov 25, 2025·0 cites·7 claims
- 1964US10857762B2Polymer film coated with a layer of silane coupling agentTOYO BOSEKI·Filed 2015·Granted Dec 8, 2020·1 cites·4 claims
- 2062US2024278537A1Laminate rollTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 2160US2024336033A1LaminateTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 2259US11833795B2Multilayer body and method for producing flexible deviceTOYO BOSEKI·Filed 2021·Granted Dec 5, 2023·0 cites·4 claims
- 2359US5054296APipe for cooling unit, cooling unit and individual cooling systemFURUKAWA ELECTRIC CO LTD·Filed 1990·Granted Oct 8, 1991·27 cites·15 claims
- 2458US6722956B2Working apparatusNIPPEI TOYAMA CORP·Filed 2000·Granted Apr 20, 2004·9 cites·21 claims
- 2558US4833059ADeveloping method using one-component non-magnetic toner with positive frictional chargeTOSHIBA KK·Filed 1987·Granted May 23, 1989·11 cites·5 claims
- 2656US12489044B2Method for producing layered body, layered body, and multilayered bodyTOYO BOSEKI·Filed 2021·Granted Dec 2, 2025·0 cites·10 claims
- 2756US5912320APolyphenylene sulfide resin composition and resin-encapsulated semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 15, 1999·20 cites·18 claims
- 2856US5001018AFe-Co base magnetic film and process for producing the sameKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Mar 19, 1991·11 cites·3 claims
- 2956US2024227363A1Laminate of inorganic substrate and heat-resistant polymer filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 3056US2024375381A1Transparent heat-resistant laminated filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 3156US2024227373A1Multilayer body of inorganic substrate and transparent heat-resistant polymer filmTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 3255US11065853B2Polyimide film layered bodyTOYO BOSEKI·Filed 2017·Granted Jul 20, 2021·0 cites·4 claims
- 3355US2024246319A1LaminateTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 3453US2024059057A1Laminated film, laminated film manufacturing method, laminate, and laminate manufacturing methodTOYO BOSEKI·Filed 2021·Application pending·0 cites
- 3553US2024153785A1Polymer film releasing method, method for manufacturing electronic device, and releasing deviceTOYO BOSEKI·Filed 2022·Application pending·0 cites
- 3652US11655118B2Film roll and film bundleTOYO BOSEKI·Filed 2018·Granted May 23, 2023·0 cites·20 claims
- 3752US2023211584A1Layered product including high temperature-resistant transparent filmTOYO BOSEKI·Filed 2021·Application pending·0 cites
- 3852US2023173800A1Multilayer body comprising highly heat-resistant transparent filmTOYO BOSEKI·Filed 2021·Application pending·0 cites
- 3951US2021308987A1Laminate, and method for producing laminateTOYO BOSEKI·Filed 2019·Application pending·0 cites
- 4046US12115755B2Laminate of polyimide film and inorganic substrateTOYO BOSEKI·Filed 2018·Granted Oct 15, 2024·0 cites·10 claims
- 4146US5212482ADigital-to-analog converter having an externally selectable output voltage rangeFUJITSU LTD·Filed 1991·Granted May 18, 1993·11 cites·30 claims
- 4246US2023271367A1Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic deviceTOYO BOSEKI·Filed 2021·Application pending·0 cites
- 4346US2022274314A1Apparatus for manufacturing laminate and method for manufacturing laminateTOYO BOSEKI·Filed 2020·Application pending·0 cites
- 4446US2022143964A1Heat-resistant polymer film laminate and method for producing heat-resistant polymer film laminateTOYO BOSEKI·Filed 2020·Application pending·0 cites
- 4545US2004241537A1Air batteryFiled 2004·Application pending·0 cites
- 4638US6113489AIngot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatusNIPPEI TOYAMA CORP·Filed 1999·Granted Sep 5, 2000·8 cites·3 claims
- 4737US2021345484A1Method for manufacturing device connected body, and device connected bodyTOYO BOSEKI·Filed 2019·Application pending·0 cites
- 4835US2004183215A1Electronic device using coating epoxy resin compositionTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4934US5328746AThermal transfer recording mediumTOSHIBA KK·Filed 1992·Granted Jul 12, 1994·5 cites·25 claims
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