Inventor · disambiguated record
Mohanraj Soundarapandian
Also filed as: SOUNDARAPANDIAN MOHANRAJ
2 granted patents·60 citations·filing 2004–2007
62Inventor score
Technology areasH10P
Files withAGENCY SCIENCE TECH & RES2
Top patents by PatentIndex Score
2 records- 0188US7183176B2Method of forming through-wafer interconnects for vertical wafer level packagingAGENCY SCIENCE TECH & RES·Filed 2004·Granted Feb 27, 2007·57 cites·28 claims
- 0267US7381629B2Method of forming through-wafer interconnects for vertical wafer level packagingAGENCY SCIENCE TECH & RES·Filed 2007·Granted Jun 3, 2008·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →