Inventor · disambiguated record
Keith K. Chao
Also filed as: CHAO KEITH · CHAO KEITH K
23 granted patents·2,417 citations·filing 1994–2003
97Inventor score
Top patents by PatentIndex Score
23 records- 0199US6269472B1Optical proximity correction method and apparatusLSI LOGIC CORP·Filed 1997·Granted Jul 31, 2001·356 cites·22 claims
- 0299US5705301APerforming optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1996·Granted Jan 6, 1998·491 cites·18 claims
- 0398US6282696B1Performing optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1999·Granted Aug 28, 2001·278 cites·17 claims
- 0498US5723233AOptical proximity correction method and apparatusLSI LOGIC CORP·Filed 1996·Granted Mar 3, 1998·323 cites·17 claims
- 0597US6081659AComparing aerial image to actual photoresist pattern for masking process characterizationLSI LOGIC CORP·Filed 1999·Granted Jun 27, 2000·180 cites·13 claims
- 0697US6078738AComparing aerial image to SEM of photoresist or substrate pattern for masking process characterizationLSI LOGIC CORP·Filed 1997·Granted Jun 20, 2000·182 cites·13 claims
- 0793US5804340APhotomask inspection method and inspection tape thereforLSI LOGIC CORP·Filed 1996·Granted Sep 8, 1998·99 cites·15 claims
- 0892US5900338APerforming optical proximity correction with the aid of design rule checkersLSI LOGIC CORP·Filed 1997·Granted May 4, 1999·86 cites·13 claims
- 0991US6499003B2Method and apparatus for application of proximity correction with unitary segmentationLSI LOGIC CORP·Filed 1998·Granted Dec 24, 2002·88 cites·13 claims
- 1090US5663017AOptical corrective techniques with reticle formation and reticle stitching to provide design flexibilityLSI LOGIC CORP·Filed 1995·Granted Sep 2, 1997·78 cites·25 claims
- 1179US6532585B1Method and apparatus for application of proximity correction with relative segmentationLSI LOGIC CORP·Filed 2000·Granted Mar 11, 2003·15 cites·35 claims
- 1278US6109775AMethod for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereonLSI LOGIC CORP·Filed 1997·Granted Aug 29, 2000·60 cites·18 claims
- 1374US6713386B1Method of preventing resist poisoning in dual damascene structuresLSI LOGIC CORP·Filed 2001·Granted Mar 30, 2004·17 cites·4 claims
- 1470US6175953B1Method and apparatus for general systematic application of proximity correctionLSI LOGIC CORP·Filed 1998·Granted Jan 16, 2001·29 cites·30 claims
- 1564US5549934AProcess of curing hydrogen silsesquioxane coating to form silicon oxide layerLSI LOGIC CORP·Filed 1995·Granted Aug 27, 1996·24 cites·15 claims
- 1662US6157087AConsistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protective layerLSI LOGIC CORP·Filed 1999·Granted Dec 5, 2000·22 cites·5 claims
- 1760US5456952AProcess of curing hydrogen silsesquioxane coating to form silicon oxide layerLSI LOGIC CORP·Filed 1994·Granted Oct 10, 1995·26 cites·19 claims
- 1857US5652163AUse of reticle stitching to provide design flexibilityLSI LOGIC CORP·Filed 1994·Granted Jul 29, 1997·17 cites·7 claims
- 1954US6174630B1Method of proximity correction with relative segmentationLSI LOGIC CORP·Filed 1998·Granted Jan 16, 2001·12 cites·18 claims
- 2051US6969683B2Method of preventing resist poisoning in dual damascene structuresLSI LOGIC CORP·Filed 2003·Granted Nov 29, 2005·3 cites·16 claims
- 2149US6060787AConsistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layerLSI LOGIC CORP·Filed 1999·Granted May 9, 2000·12 cites·14 claims
- 2247US5981352AConsistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layerLSI LOGIC CORP·Filed 1997·Granted Nov 9, 1999·11 cites·11 claims
- 2342US5966613AConsistent alignment mark profiles on semiconductor wafers using metal organic chemical vapor deposition titanium nitride protectiveLSI CORP·Filed 1997·Granted Oct 12, 1999·8 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →