Inventor · disambiguated record
Shigeru Oba
Also filed as: OBA SHIGERU
5 granted patents·1 pending application·6 citations·filing 2002–2023
64Inventor score
Top patents by PatentIndex Score
6 records- 0152US12449378B2Edge portion measuring apparatus and method for measuring edge portionSHIN ETSU HANDOTAI CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·16 claims
- 0251US6768965B2Methods and computer program products for characterizing a crystalline structureSEH AMERICA INC·Filed 2002·Granted Jul 27, 2004·6 cites·29 claims
- 0344US9748089B2Method for producing mirror-polished waferSHINETSU HANDOTAI KK·Filed 2014·Granted Aug 29, 2017·0 cites·3 claims
- 0439US9156123B2Double-side polishing methodSHINETSU HANDOTAI KK·Filed 2012·Granted Oct 13, 2015·0 cites·4 claims
- 0531US2014162456A1Method for polishing silicon wafer and polishing agentOBA SHIGERU·Filed 2012·Application pending·0 cites
- 0630US10147656B2Sizing device, polishing apparatus, and polishing methodSHINETSU HANDOTAI KK·Filed 2016·Granted Dec 4, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →