Inventor · disambiguated record
Kaoru Oogaya
Also filed as: OOGAYA KAORU
2 granted patents·176 citations·filing 1989–1991
70Inventor score
Technology areasH10W
Files withHITACHI LTD2
Top patents by PatentIndex Score
2 records- 0188US5027188ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1989·Granted Jun 25, 1991·91 cites·20 claims
- 0283US5220199ASemiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrateHITACHI LTD·Filed 1991·Granted Jun 15, 1993·85 cites·34 claims
Join the waitlist — get patent alerts
Get an alert when Kaoru Oogaya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →