Inventor · disambiguated record
Tetsuya Mieda
Also filed as: MIEDA TETSUYA
18 granted patents·5 pending applications·16 citations·filing 2000–2023
88Inventor score
Top patents by PatentIndex Score
23 records- 0178US10084153B2Filler material for organic electroluminescent element and method of sealing organic electroluminiscent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Sep 25, 2018·1 cites·8 claims
- 0275US9913324B2Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these filmsFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Mar 6, 2018·1 cites·10 claims
- 0374US9758690B2Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying imageFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Sep 12, 2017·1 cites·8 claims
- 0469US10115904B2Transparent resin composition for organic electroluminescent element sealing, resin sheet for organic electroluminescent element sealing, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Oct 30, 2018·2 cites·9 claims
- 0563US6656996B2Semiconductor-sealing resin composition and semiconductor device using itSUMITOMO BAKELITE CO·Filed 2000·Granted Dec 2, 2003·11 cites·12 claims
- 0659US12068088B2Power cable, and method for manufacturing power cableFURUKAWA ELECTRIC CO LTD·Filed 2022·Granted Aug 20, 2024·0 cites·9 claims
- 0759US10988646B2Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·4 claims
- 0856US2025215202A1Insulating resin composition for electric power cable and electric power cableFURUKAWA ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 0955US2025034381A1Insulating resin composition for electric power cable, electric power cable, and electric power cable connecting partFURUKAWA ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 1050US10556974B2Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Feb 11, 2020·0 cites·6 claims
- 1149US11990253B2Insulating resin composition and production method therefor, insulating tape and production method therefor, insulating layer formation method, and power cable and production method thereforFURUKAWA ELECTRIC CO LTD·Filed 2020·Granted May 21, 2024·0 cites·16 claims
- 1249US11139449B2Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatusFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Oct 5, 2021·0 cites·13 claims
- 1349US9257671B2Resin composition for sealing organic electroluminescent device; method of producing the same; and adhesive film, gas-barrier film, organic electroluminescent device and organic electroluminescent panel using the resin compositionFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·12 claims
- 1447US11823816B2Insulating tape for coating connection portion of power cable, method for forming insulating coating on exterior surface of connection portion of power cable, and power cableFURUKAWA ELECTRIC CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·11 claims
- 1547US9793511B2Filler material for organic electroluminescent element and method of sealing organic electroluminescent elementFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Oct 17, 2017·0 cites·20 claims
- 1645US10043996B2Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·17 claims
- 1742US10829670B2Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·12 claims
- 1842US10079360B2Resin composition for sealing electronic devices, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Sep 18, 2018·0 cites·9 claims
- 1941US10829669B2Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·7 claims
- 2038US2016020423A1Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 2136US2016017197A1Element sealing resin composition for organic electronic device, element sealing resin sheet for organic electronic device, organic electroluminescence element, and image displayFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 2235US10196534B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·13 claims
- 2332US2016017186A1Sealant composition and sealing sheet obtained from the compositionFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →