Inventor · disambiguated record
Seung Wook Yoon
Also filed as: YOON SEUNG WOOK
24 granted patents·307 citations·filing 2004–2022
95Inventor score
Files withSTATS CHIPPAC PTE LTD9STATS CHIPPAC LTD8JCET SEMICONDUCTOR SHAOXING CO LTD2KOO JUN MO2AGENCY FOR SCIENCE TECHOLOGY A1
Top patents by PatentIndex Score
24 records- 0198US9064936B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2013·Granted Jun 23, 2015·58 cites·12 claims
- 0297US9224647B2Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposerKOO JUN MO·Filed 2011·Granted Dec 29, 2015·109 cites·14 claims
- 0397US8993377B2Semiconductor device and method of bonding different size semiconductor die at the wafer levelKOO JUN MO·Filed 2011·Granted Mar 31, 2015·70 cites·28 claims
- 0496US12094729B2Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 17, 2024·2 cites·22 claims
- 0596US9768155B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2015·Granted Sep 19, 2017·14 cites·19 claims
- 0693US10475779B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC PTE LTD·Filed 2017·Granted Nov 12, 2019·7 cites·25 claims
- 0792US9293401B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)STATS CHIPPAC LTD·Filed 2013·Granted Mar 22, 2016·11 cites·22 claims
- 0884US9620413B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC LTD·Filed 2013·Granted Apr 11, 2017·4 cites·25 claims
- 0982US9496195B2Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC LTD·Filed 2013·Granted Nov 15, 2016·4 cites·23 claims
- 1081US9704769B2Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)STATS CHIPPAC LTD·Filed 2015·Granted Jul 11, 2017·3 cites·23 claims
- 1180US10446459B2Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP)STATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 15, 2019·2 cites·19 claims
- 1277US9224693B2Semiconductor device and method of forming TMV and TSV in WLCSP using same carrierSTATS CHIPPAC LTD·Filed 2014·Granted Dec 29, 2015·3 cites·25 claims
- 1374US11961764B2Semiconductor device and method of making a wafer-level chip-scale packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·17 claims
- 1471US10515828B2Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2016·Granted Dec 24, 2019·1 cites·21 claims
- 1566US7160756B2Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devicesAGENCY FOR SCIENCE TECHOLOGY A·Filed 2004·Granted Jan 9, 2007·18 cites·26 claims
- 1664US11222793B2Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2019·Granted Jan 11, 2022·0 cites·24 claims
- 1763US11011423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2018·Granted May 18, 2021·0 cites·19 claims
- 1862US11257729B2Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)JCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·17 claims
- 1961US9640603B2Semiconductor device and method of forming inductor over insulating material filled trench in substrateSTATS CHIPPAC LTD·Filed 2014·Granted May 2, 2017·1 cites·19 claims
- 2058US10181423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jan 15, 2019·0 cites·13 claims
- 2154US12096217B2PUF-based IoT device using channel state information, and authentication method thereofGWANGJU INST SCIENCE & TECH·Filed 2022·Granted Sep 17, 2024·0 cites·11 claims
- 2251US10903304B2Semiconductor device and method of forming inductor over insulating material filled trench in substrateSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jan 26, 2021·0 cites·22 claims
- 2351US10622293B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)JCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted Apr 14, 2020·0 cites·25 claims
- 2437US10213396B2Patch to enhance locally fat metabolism, using thermoplastic elastomer gel composition including capsaicinSENNY STUDIO CO LTD·Filed 2017·Granted Feb 26, 2019·0 cites·5 claims
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