Inventor · disambiguated record
Heinz-Peter Wirtz
Also filed as: WIRTZ HEINZ-PETER
12 granted patents·1 pending application·22 citations·filing 2003–2021
87Inventor score
Top patents by PatentIndex Score
13 records- 0196US12094729B2Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 17, 2024·2 cites·22 claims
- 0284US9620413B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC LTD·Filed 2013·Granted Apr 11, 2017·4 cites·25 claims
- 0382US9496195B2Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC LTD·Filed 2013·Granted Nov 15, 2016·4 cites·23 claims
- 0474US11961764B2Semiconductor device and method of making a wafer-level chip-scale packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 16, 2024·0 cites·17 claims
- 0571US10515828B2Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2016·Granted Dec 24, 2019·1 cites·21 claims
- 0664US11222793B2Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSPSTATS CHIPPAC PTE LTD·Filed 2019·Granted Jan 11, 2022·0 cites·24 claims
- 0763US11011423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2018·Granted May 18, 2021·0 cites·19 claims
- 0858US10181423B2Semiconductor device and method of using a standardized carrier in semiconductor packagingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jan 15, 2019·0 cites·13 claims
- 0958US8125074B2Laminated substrate for an integrated circuit BGA package and printed circuit boardsSLAVOV NEDYALKO·Filed 2009·Granted Feb 28, 2012·3 cites·13 claims
- 1054US7500617B2Screw device for high-adjusting a track spanRAIL ONE GMBH·Filed 2003·Granted Mar 10, 2009·6 cites·11 claims
- 1145US2011064362A1Integrated circuit device or package and integrated circuit system, with an optical wave-guide elementST ERICSSON SA·Filed 2009·Application pending·0 cites
- 1242US7692280B2Portable object connectable packageST ERICSSON SA·Filed 2006·Granted Apr 6, 2010·2 cites·32 claims
- 1340US8222722B2Integrated circuit package and deviceSLAVOV NEDYALKO·Filed 2009·Granted Jul 17, 2012·0 cites·21 claims
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