Inventor · disambiguated record
Keiichiro Tsutsumi
Also filed as: TSUTSUMI KEIICHIRO
1 granted patent·2 pending applications·0 citations·filing 2010–2013
8Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0143US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 0238US2015294900A1Room-temperature bonded device, wafer having room-temperature bonded device, and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 0332US2012247645A1Bonding method, bonding apparatus, and bonding systemTSUTSUMI KEIICHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →