Inventor · disambiguated record
Duanliang Cheng
Also filed as: CHENG DUANLIANG
11 granted patents·1 pending application·23 citations·filing 2016–2021
84Inventor score
Files withNINGBO SUNNY OPOTECH CO LTD12
Top patents by PatentIndex Score
12 records- 0193US9894772B2Manufacturing method of molded photosensitive assembly for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Feb 13, 2018·11 cites·30 claims
- 0288US10197890B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·14 claims
- 0388US9781324B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Oct 3, 2017·6 cites·24 claims
- 0467US9955055B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Apr 24, 2018·1 cites·30 claims
- 0566US10630876B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2017·Granted Apr 21, 2020·1 cites·20 claims
- 0665US11451693B2Camera module and molding circuit board assembly, circuit board and application thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·20 claims
- 0762US11163216B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 0854US11039052B2Camera module and molding circuit board assembly, circuit board and application thereofNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jun 15, 2021·0 cites·19 claims
- 0954US2021203818A1Camera module, molding photosensitive assembly thereof, manufacturing method and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2021·Application pending·0 cites
- 1053US10979610B2Camera module, molding photosensitive assembly thereof, manufacturing method and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Apr 13, 2021·0 cites·18 claims
- 1153US10670946B2Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 1248US11032454B2Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic deviceNINGBO SUNNY OPOTECH CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →