Inventor · disambiguated record
Nai-Hao Kao
Also filed as: KAO NAI-HAO
2 granted patents·8 pending applications·16 citations·filing 2003–2024
54Inventor score
Top patents by PatentIndex Score
10 records- 0164US6819565B2Cavity-down ball grid array semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 16, 2004·15 cites·10 claims
- 0258US2025309040A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0357US2025102750A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0455US2024274495A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0554US2024274505A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0653US2025138262A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0750US2023378072A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 0848US8207620B2Flip-chip semiconductor package and chip carrier for preventing corner delaminationTZENG YUAN-LIN·Filed 2007·Granted Jun 26, 2012·1 cites·10 claims
- 0946US2024145455A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1038US2020328142A1Package stack structure, method for fabricating the same, and carrier componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →