Inventor · disambiguated record
Gong Jin
Also filed as: JIN GONG
5 granted patents·3 pending applications·2 citations·filing 2013–2017
65Inventor score
Files withZHONGAO HUICHENG TECH CO LTD3BEIJING XINNA INTERNATIONAL NEW MATERIALS TECH CO LTD2BEIJING NANO HI TECH MAT CO LTD1BEIJING XINNA INTERNATIONAL NEW MAT TECHNOLGY CO LTD1BEIJING ZHONGAO HUICHENG BIOLOGY TECH MATERIAL CO LTD1
Top patents by PatentIndex Score
8 records- 0165US9486844B2Method and device for treatment of saline-alkali landBEIJING NANO HI-TECH MAT CO LTD·Filed 2014·Granted Nov 8, 2016·2 cites·13 claims
- 0254US10233537B2Artificial joint cup, magnetic control sputtering coating film device and preparation method thereofZHONGAO HUICHENG TECH CO LTD·Filed 2014·Granted Mar 19, 2019·0 cites·27 claims
- 0348US9799498B2Magnetron sputtering coating device, a nano-multilayer film, and the preparation method thereofZHONGAO HUICHENG TECH CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·10 claims
- 0448US9657390B2Magnetron sputtering coating device, a nano-multilayer film, and the preparation method thereofZHONGAO HUICHENG TECH CO LTD·Filed 2015·Granted May 23, 2017·0 cites·13 claims
- 0547US9127347B2Magnetron sputtering coating device, a nano-multilayer film, and the preparation method thereofBEIJING ZHONGAO HUICHENG BIOLOGY TECH MATERIAL CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·9 claims
- 0638US2019276374A1Novel carbon-based material and application thereofBEIJING XINNA INTERNATIONAL NEW MATERIALS TECH CO LTD·Filed 2017·Application pending·0 cites
- 0732US2021284909A1Carbon-based functional material and applicationsBEIJING XINNA INTERNATIONAL NEW MAT TECHNOLGY CO LTD·Filed 2016·Application pending·0 cites
- 0827US2020305374A1Method for inducing active response of plantsBEIJING XINNA INTERNATIONAL NEW MATERIALS TECH CO LTD·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gong Jin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →