Inventor · disambiguated record
Paul F. Fortier
Also filed as: FORTIER PAUL · FORTIER PAUL F · FORTIER PAUL FRANCIS
52 granted patents·2 pending applications·472 citations·filing 2000–2020
98Inventor score
Top patents by PatentIndex Score
54 records- 0196US8483253B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Jul 9, 2013·27 cites·14 claims
- 0296US6712527B1Fiber optic connections and method for using sameIBM·Filed 2000·Granted Mar 30, 2004·100 cites·23 claims
- 0394US10295749B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 21, 2019·13 cites·15 claims
- 0494US9720188B2Connecting mid-board optical modulesIBM·Filed 2015·Granted Aug 1, 2017·15 cites·19 claims
- 0594US9568682B1Component and chip assembly structure for high yield parallelized fiber assemblyIBM·Filed 2016·Granted Feb 14, 2017·20 cites·20 claims
- 0693US9360644B2Laser die and photonics die packageIBM·Filed 2014·Granted Jun 7, 2016·14 cites·18 claims
- 0792US10613282B2Fluid control structureIBM·Filed 2018·Granted Apr 7, 2020·8 cites·15 claims
- 0892US9989713B1Fluid control structureIBM·Filed 2017·Granted Jun 5, 2018·8 cites·10 claims
- 0992US8111730B23D optoelectronic packagingBUDD RUSSELL A·Filed 2009·Granted Feb 7, 2012·20 cites·8 claims
- 1091US11209598B2Photonics package with face-to-face bondingIBM·Filed 2019·Granted Dec 28, 2021·11 cites·19 claims
- 1191US9835804B2Connecting mid-board optical modulesIBM·Filed 2017·Granted Dec 5, 2017·7 cites·20 claims
- 1291US9316796B2Fiber pigtail with integrated lidIBM·Filed 2015·Granted Apr 19, 2016·7 cites·4 claims
- 1390US8290008B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2009·Granted Oct 16, 2012·18 cites·12 claims
- 1490US6508595B1Assembly of opto-electronic module with improved heat sinkIBM·Filed 2000·Granted Jan 21, 2003·58 cites·11 claims
- 1589US8411719B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Apr 2, 2013·8 cites·4 claims
- 1688US9706670B1Connecting mid-board electronic devicesIBM·Filed 2015·Granted Jul 11, 2017·7 cites·20 claims
- 1788US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 1887US10754070B2Microlens array assembling processIBM·Filed 2018·Granted Aug 25, 2020·6 cites·10 claims
- 1986US8559474B2Silicon carrier optoelectronic packagingANDRY PAUL S·Filed 2012·Granted Oct 15, 2013·9 cites·6 claims
- 2084US9662830B2Bondline control fixture and method of affixing first and second componentsIBM·Filed 2015·Granted May 30, 2017·2 cites·15 claims
- 2184US9656420B2Bondline control fixture and method of affixing first and second componentsIBM·Filed 2015·Granted May 23, 2017·2 cites·17 claims
- 2282US9958625B2Structured substrate for optical fiber alignmentIBM·Filed 2017·Granted May 1, 2018·2 cites·1 claims
- 2381US9671578B2Structured substrate for optical fiber alignmentIBM·Filed 2015·Granted Jun 6, 2017·2 cites·9 claims
- 2481US9658415B2Structured substrate for optical fiber alignmentIBM·Filed 2015·Granted May 23, 2017·2 cites·3 claims
- 2581US9246592B2Structured substrate for optical fiber alignmentIBM·Filed 2013·Granted Jan 26, 2016·3 cites·10 claims
- 2680US10371907B2Fluid control structureIBM·Filed 2017·Granted Aug 6, 2019·2 cites·20 claims
- 2780US9093563B2Electronic module assembly with patterned adhesive arrayIBM·Filed 2013·Granted Jul 28, 2015·4 cites·21 claims
- 2880US6822875B2Assembly of opto-electronic module with improved heat sinkIBM·Filed 2002·Granted Nov 23, 2004·27 cites·2 claims
- 2979US6547452B1Alignment systems for subassemblies of overmolded optoelectronic modulesIBM·Filed 2000·Granted Apr 15, 2003·22 cites·12 claims
- 3078US11280968B2High-bandwidth embedded optical connector with latching mechanismIBM·Filed 2020·Granted Mar 22, 2022·1 cites·18 claims
- 3176US10338325B1Nanofiller in an optical interfaceIBM·Filed 2018·Granted Jul 2, 2019·2 cites·19 claims
- 3276US9651747B1Fiber pigtail assembly with integrated lid enabling optical fiber mobilityIBM·Filed 2016·Granted May 16, 2017·2 cites·20 claims
- 3372US10073223B2Connecting mid-board optical modulesIBM·Filed 2017·Granted Sep 11, 2018·1 cites·20 claims
- 3472US9400356B2Fiber pigtail with integrated lidIBM·Filed 2013·Granted Jul 26, 2016·2 cites·15 claims
- 3571US10690867B1Optical device with adhesive connection of recess or side protrusionIBM·Filed 2019·Granted Jun 23, 2020·1 cites·25 claims
- 3671US10128590B2Pluggable LGA socket for high density interconnectsIBM·Filed 2015·Granted Nov 13, 2018·2 cites·10 claims
- 3770US9810864B2Fiber pigtail assembly with integrated lid enabling optical fiber mobilityIBM·Filed 2017·Granted Nov 7, 2017·1 cites·20 claims
- 3866US9897444B2Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnectIBM·Filed 2014·Granted Feb 20, 2018·2 cites·20 claims
- 3965US9243784B2Semiconductor photonic packageIBM·Filed 2012·Granted Jan 26, 2016·1 cites·7 claims
- 4065US9206965B2Semiconductor photonic packageIBM·Filed 2013·Granted Dec 8, 2015·1 cites·10 claims
- 4161US9577361B2Pluggable LGA socket for high density interconnectsIBM·Filed 2014·Granted Feb 21, 2017·2 cites·8 claims
- 4261US6652159B2Enhanced optical transceiver arrangementIBM·Filed 2001·Granted Nov 25, 2003·7 cites·33 claims
- 4359US10302869B1Optical interconnect attach to photonic device with partitioning adhesive functionIBM·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 4459US9701872B2Picktip having non-planar topographyIBM·Filed 2014·Granted Jul 11, 2017·0 cites·16 claims
- 4559US6516129B2Processing protective plug insert for optical modulesJDS UNIPHASE CORP·Filed 2001·Granted Feb 4, 2003·6 cites·19 claims
- 4656US9293439B2Electronic module assembly with patterned adhesive arrayGLOBALFOUNDRIES INC·Filed 2014·Granted Mar 22, 2016·0 cites·7 claims
- 4753US11146003B2Pluggable LGA socket for high density interconnectsIBM·Filed 2018·Granted Oct 12, 2021·0 cites·18 claims
- 4852US9759868B2Structures for preventing dicing damageIBM·Filed 2015·Granted Sep 12, 2017·0 cites·20 claims
- 4951US9393633B2Method of joining a chip on a substrateBLAIS PASCAL P·Filed 2009·Granted Jul 19, 2016·1 cites·18 claims
- 5047US10969222B2Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnectIBM·Filed 2017·Granted Apr 6, 2021·0 cites·20 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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