Individual holder
BUDD RUSSELL A
US·12 granted patents·131 citations·filing 2004–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
12 records- 0196US8483253B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Jul 9, 2013·27 cites·14 claims
- 0292US8111730B23D optoelectronic packagingBUDD RUSSELL A·Filed 2009·Granted Feb 7, 2012·20 cites·8 claims
- 0389US8755644B2Silicon based optical viasBUDD RUSSELL A·Filed 2008·Granted Jun 17, 2014·16 cites·44 claims
- 0489US8411719B23D optoelectronic packagingBUDD RUSSELL A·Filed 2012·Granted Apr 2, 2013·8 cites·4 claims
- 0589US8289231B2Compact optical system and packaging for head mounted displayBUDD RUSSELL A·Filed 2004·Granted Oct 16, 2012·39 cites·1 claims
- 0683US8181846B2Method of full-field solder coverage using a vacuum fill headBUDD RUSSELL A·Filed 2011·Granted May 22, 2012·4 cites·5 claims
- 0781US9341828B2Multi-core fiber optical coupling elementsBUDD RUSSELL A·Filed 2011·Granted May 17, 2016·5 cites·22 claims
- 0878US9314864B2C4NP compliant solder fill head sealsBUDD RUSSELL A·Filed 2007·Granted Apr 19, 2016·5 cites·11 claims
- 0976US8087566B2Techniques for arranging solder balls and forming bumpsBUDD RUSSELL A·Filed 2009·Granted Jan 3, 2012·4 cites·6 claims
- 1071US8596879B2Method to reorder (shuffle) optical cable waveguide layersBUDD RUSSELL A·Filed 2011·Granted Dec 3, 2013·2 cites·9 claims
- 1160US8703274B2Microcavity structure and processBUDD RUSSELL A·Filed 2008·Granted Apr 22, 2014·1 cites·25 claims
- 1257US8286855B2Method of full-field solder coverage by inverting a fill head and a moldBUDD RUSSELL A·Filed 2012·Granted Oct 16, 2012·0 cites·6 claims
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