Inventor · disambiguated record
Byung-Seok Jun
Also filed as: JUN BYUNG J · JUN BYUNG-SEOK
2 granted patents·3 pending applications·66 citations·filing 2004–2008
65Inventor score
Top patents by PatentIndex Score
5 records- 0187US7262080B2BGA package with stacked semiconductor chips and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 28, 2007·58 cites·22 claims
- 0275US7528475B2BGA package with stacked semiconductor chips and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 5, 2009·8 cites·10 claims
- 0347US2009017583A1Double encapsulated semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0443US2007164407A1Double encapsulated semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0541US2006126774A1Internal circulating irradiation capsule for iodine-125 and method of producing iodine-125 using sameKOREA ATOMIC ENERGY RES·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Byung-Seok Jun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →