Inventor · disambiguated record
Young Ki Ko
Also filed as: KO YOUNG KI
4 granted patents·3 citations·filing 2009–2017
58Inventor score
Top patents by PatentIndex Score
4 records- 0161US8486827B2Device of filling metal in through-via-hole of semiconductor wafer and method using the sameYOO SE HOON·Filed 2009·Granted Jul 16, 2013·3 cites·6 claims
- 0241US10545303B2Optical cable and optical cable assembly having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 28, 2020·0 cites·18 claims
- 0339US10115635B2Method for filling a wafer via with solderKOREA INST IND TECH·Filed 2017·Granted Oct 30, 2018·0 cites·2 claims
- 0435US9603254B2Apparatus for filling a wafer via with solderYOO SEHOON·Filed 2012·Granted Mar 21, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →