Inventor · disambiguated record
Fukumi Shimizu
Also filed as: SHIMIZU FUKUMI
15 granted patents·5 pending applications·108 citations·filing 1992–2017
91Inventor score
Files withRENESAS TECH CORP6KURATOMI BUNSHI4RENESAS ELECTRONICS CORP4RENESAS E JP SEMICONDUCTOR INC2TOSHIBA KK2
Top patents by PatentIndex Score
20 records- 0177US5502650AApparatus for adjusting rotorTOSHIBA KK·Filed 1993·Granted Mar 26, 1996·43 cites·7 claims
- 0276US9966329B2Method for manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted May 8, 2018·3 cites·13 claims
- 0373US7377031B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·4 cites·3 claims
- 0471US6797542B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Sep 28, 2004·18 cites·7 claims
- 0570US7445969B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Nov 4, 2008·4 cites·3 claims
- 0665US7681308B2Fabrication method of semiconductor integrated circuit deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2008·Granted Mar 23, 2010·2 cites·5 claims
- 0765US7037760B2Fabrication method of semiconductor integrated circuit deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted May 2, 2006·9 cites·19 claims
- 0862US8117742B2Fabrication method of semiconductor integrated circuit deviceKURATOMI BUNSHI·Filed 2010·Granted Feb 21, 2012·1 cites·8 claims
- 0960US5293040AMethod and apparatus for measuring vibrations of rotating shaftTOSHIBA KK·Filed 1992·Granted Mar 8, 1994·20 cites·10 claims
- 1056US9153527B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 6, 2015·0 cites·10 claims
- 1154US8772090B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 8, 2014·0 cites·14 claims
- 1252US7288440B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Oct 30, 2007·4 cites·20 claims
- 1348US2016005699A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1444US2008173995A1Memory card and manufacturing method of the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 1542US7632720B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Dec 15, 2009·0 cites·10 claims
- 1640US2009160084A1Manufacturing method of semiconductor deviceKURATOMI BUNSHI·Filed 2006·Application pending·0 cites
- 1740US2008020510A1Fabrication method of semiconductor deviceKURATOMI BUNSHI·Filed 2007·Application pending·0 cites
- 1838US2005106786A1Method of manufacturing a semiconductor deviceFiled 2004·Application pending·0 cites
- 1936US8476113B2Method of manufacturing semiconductor deviceKURATOMI BUNSHI·Filed 2011·Granted Jul 2, 2013·0 cites·16 claims
- 2033US7144755B2Fabrication method of semiconductor integrated circuit deviceEASTERN JAPAN SEMICONDUCTOR TE·Filed 2004·Granted Dec 5, 2006·0 cites·6 claims
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