Inventor · disambiguated record
Masaaki Imanari
Also filed as: IMANARI MASAAKI
2 granted patents·10 pending applications·21 citations·filing 2001–2017
59Inventor score
Top patents by PatentIndex Score
12 records- 0173US6740425B2Method for manufacturing copper-resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 25, 2004·15 cites·12 claims
- 0266US6899781B2Method for forming resin composite materialSHIPLEY CO LLC·Filed 2002·Granted May 31, 2005·6 cites·13 claims
- 0366US2010038254A1Tin electroplating solution and tin electroplating methodROHM & HAAS ELECT MAT·Filed 2009·Application pending·0 cites
- 0457US2007068823A1Tin electroplating solution and tin electroplating methodROHM & HAAS ELECT MAT·Filed 2006·Application pending·0 cites
- 0554US2010000873A1Electrolytic tin plating solution and electrolytic tin plating methodROHM & HAAS ELECT MAT·Filed 2009·Application pending·0 cites
- 0646US2005164020A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 0740US2004101665A1Direct patterning methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 0839US2018112319A1Nickel plating solutionROHM & HAAS ELECT MAT·Filed 2017·Application pending·0 cites
- 0938US2003003307A1Non-charging resin composite and method for manufacturing the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1038US2004072015A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1136US2004170846A1Resin composite material and method of forming the sameFiled 2001·Application pending·0 cites
- 1235US2004253450A1Formaldehyde-free electroless copper plating process and solution for use in the processSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →